Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3946ETG+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
MAX3964AETP+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.045 mA	3.3 V	3.3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N20	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm
PHY1090-DS-QR	Analog Devices	TELECOM CIRCUIT																													NOT SPECIFIED	NOT SPECIFIED
MAX3266C/D	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	7	DIE	RECTANGULAR	UNSPECIFIED	YES	1			50 mA	3.3 V		UNCASED CHIP				70 Cel	0 Cel	TIN LEAD	UPPER	R-XUUC-N7	1			Not Qualified		e0
DS3131DK	Analog Devices	TELECOM CIRCUIT
AD974BN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified		e0			36.687 mm
ADMP803JCEZ-RL7	Analog Devices
AD6624ABC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B196		1.5 mm	15 mm	Not Qualified		e0			15 mm
LTC4401-1ES6	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified		e0			2.9 mm
LTC1758-2EMS#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
AD974ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	Tin/Lead (Sn85Pb15)	DUAL	R-PDSO-G28	1	2 mm	5.3 mm	Not Qualified		e0	30	240	10.2 mm
AD974AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified		e0		240	17.9 mm
LTC1957-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
LTC4400-2EMS8#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
AD9082BBPZ-4D2AC	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	324	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, FINE PITCH	BGA324,18X18,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B324	3	1.72 mm	15 mm		IT CAN ALSO OPERATE WITH 1.8 AND 2 V		30	260	15 mm
HMC917LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N16	1	1 mm	3 mm					260	3 mm
V62/12649-01XE	Analog Devices		OTHER	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR			5 V	5	CHIP CARRIER	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	105 Cel	-55 Cel		QUAD	S-PQCC-N24
LT1328CS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8	1	1.752 mm	3.899 mm	Not Qualified		e0			4.9025 mm
ADSP-21BT101JST	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	R-PQFP-G128		1.6 mm	14 mm	Not Qualified		e0			20 mm
LTC4401-2EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
AD6122ACP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-N32		1 mm	5 mm	Not Qualified		e0			5 mm
IA8251-PLC28C	Analog Devices
LTC1757-1EMS8	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS				3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.635 mm	85 Cel	-30 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G8				Not Qualified		e0
ADM1041ARQZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified		e3	30	260	8.6614 mm
AD7005A	Analog Devices
AD6624AS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	FLATPACK, FINE PITCH	QFP128,.67X.93,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified					20 mm
AD6436	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				85 Cel	-40 Cel		QUAD	R-PQFP-G128				Not Qualified
AD974BRS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28	1	2 mm	5.3 mm	Not Qualified		e0		240	10.2 mm
HMC773LC3BTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N12	3	.92 mm	3 mm	Not Qualified		e4		260	3 mm
ADF5904WCCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm			e3	30	260	5 mm
ADL5350ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-XDSO-N8	1	1 mm	2 mm	Not Qualified		e3	30	260	3 mm
LTM9004IV-AA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-PBGA-N204		2.97 mm	15 mm	Not Qualified		e4			22 mm
HMC980	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	38	DIE	RECTANGULAR	UNSPECIFIED	YES	1				12 V		UNCASED CHIP				85 Cel	-55 Cel		UPPER	R-XUUC-N38			1.4 mm				NOT SPECIFIED	NOT SPECIFIED	2.26 mm
LTC4402-1EMS8#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e3		260	3 mm
ADP5589ACPZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	.8 mm	3.5 mm			e3	30	260	3.5 mm
ADSP-21MOD980N-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.9 V	1.9,3.3	GRID ARRAY	BGA352,26X26,50	Modems	1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B352		2.62 mm	35 mm	Not Qualified		e0			35 mm
HMC748LC3C	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3	1.31 mm	3 mm	Not Qualified		e4	30	260	3 mm
LTM9004IV-AC#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	GOLD	BOTTOM	R-PBGA-N204		2.97 mm	15 mm	Not Qualified		e4			22 mm
AD6679BBPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.49 mm	12 mm				30	260	12 mm
AD974AN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified		e0			36.687 mm
LTC1758-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0			3 mm
LTC1757-2CMS8	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20		.5 mm	70 Cel	0 Cel		DUAL	S-PDSO-G10	1	1.17 mm	3 mm		SEATED HT-CALCULATED			245	3 mm
AD6426XST	Analog Devices		OTHER	GULL WING	144	QFP	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR				2.4/3.3	FLATPACK	QFP144,.87SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G144				Not Qualified		e0
AD6620	Analog Devices	TELECOM CIRCUIT		GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK							QUAD	S-PQFP-G80				Not Qualified			30	220
AD6140ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20		1.98 mm	5.29 mm	Not Qualified		e0			7.2 mm
AD6624XS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified					20 mm
HMC738LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm			e3	30	260	4 mm
HMC310MS8GTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm						3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.