Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Carrier Type-3	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD8283WBCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100	.19 mA	1.8 V	1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	ATM/SONET/SDH ICs		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N72	3	.9 mm			10 mm	Not Qualified	e3	30	260	10 mm
ADP5589ACPZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	.8 mm			3.5 mm		e3	30	260	3.5 mm
ADL5350ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-XDSO-N8	1	1 mm			2 mm	Not Qualified	e3	30	260	3 mm
MAX3754CCM-T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH				.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.2 mm			7 mm	Not Qualified	e0			7 mm
78P2344-IEL/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
MAX40661C/D+	Analog Devices
78P2342JAT-IGT/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				196 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
DS2180Q	Analog Devices		COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs		1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44				T-1(DS1)		Not Qualified	e0
MAX3872ETJ-T	Analog Devices
PHY1070-01QD-RR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N36	1	.95 mm			6 mm			30	260	6 mm
MAX3266CSA+T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE				1.27 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8		1.75 mm			3.9 mm	Not Qualified	e3			4.9 mm
SC1905A-00A00	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N64		.9 mm			9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
78P2344JAT-IEL/A07R	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				380 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
73M1966-IMR	Analog Devices
MAX40661ATB+	Analog Devices	TELECOM CIRCUIT
78P2342-IGT/A07R	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				187 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
MAX3966CEE	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH				.635 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDSO-G16	1	1.73 mm			3.9 mm	Not Qualified	e0		245	4.89 mm
PHY1095-01DS-WR	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
73M1966-IM/F	Analog Devices
78P2343JAT-IEL/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				380 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
73M1966-IVTR/F	Analog Devices
MAX40016ANL+	Analog Devices	TELECOM CIRCUIT																					TIN SILVER COPPER NICKEL			1						e2	30	260
PHY1097-03DS-FR	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
MAX40016ANL+T	Analog Devices	TELECOM CIRCUIT																					TIN SILVER COPPER NICKEL			1						e2	30	260
MAX41473GTC+T	Analog Devices	TELECOM CIRCUIT																					Matte Tin (Sn) - annealed			1						e3	30	260
PHY1040-01QS-RE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	95 Cel	-40 Cel		QUAD	S-XQCC-N32		.95 mm			5 mm					5 mm
78P2343-IGT/A07R/F	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
DS31256+T	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
MAX3120CUA+T	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e3	30	260	3 mm
78P2344JAT-IGT/A07R	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				380 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
DS2153QN-A7/TR+	Analog Devices		INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES		CMOS			5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs		1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQCC-J44				CEPT PCM-30/E-1		Not Qualified	e3
78P2344-IGT/A07/F	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
DS2172T/T&R+	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK, THIN PROFILE				.8 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G32	1	1.2 mm			7 mm	Not Qualified	e3			7 mm
MAX3658AETA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	UNSPECIFIED	YES	1			.026 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.12,25	Other Telecom ICs		.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-XDSO-N8	1	.8 mm			3 mm	Not Qualified	e3	30	260	3 mm
MAX3658AE/D	Analog Devices	TELECOM CIRCUIT		NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP							TIN LEAD	UPPER	R-XUUC-N10						Not Qualified	e0
MAX40660A/D+	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
MAX3799ETJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm			5 mm	Not Qualified	e3	30	260	5 mm
MAX3983UGK+D	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs		.5 mm	85 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-XQCC-N68	3	.9 mm			10 mm	Not Qualified	e3	30	260	10 mm
78P2344-IGT/A07R/F	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
78P2343-IEL/A07	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
MAX3120EUA+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.65 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	DUAL	S-PDSO-G8	1	1.1 mm			3 mm	Not Qualified	e3	30	260	3 mm
MAX41474GTC+	Analog Devices	TELECOM CIRCUIT																					Matte Tin (Sn) - annealed			1						e3	30	260
78Q2120C09A-64CGT/F	Analog Devices
78A207-CP/F	Analog Devices
MAX3983UGK	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.4SQ,20	Other Telecom ICs		.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD	S-XQCC-N68		.9 mm			10 mm	Not Qualified	e0			10 mm
PHY1097-03DS-WR	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED
78P2344-IEL/A07R/F	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				355 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified
78P2342JAT-IGT/A07R	Analog Devices		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				196 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	T-3(DS3)	.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G100			STS-1/OC-1	E-3		Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.