Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADN2880ACHIPS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	17	DIE	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		95 Cel	-40 Cel		UPPER	R-XUUC-N17				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD9081BBPZ-4D4AC	Analog Devices	TELECOM CIRCUIT
HMC6301BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	75	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						1.35 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B75	1	.815 mm	4 mm			30	260	6 mm
AD6652BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3		17 mm	Not Qualified	e1		260	17 mm
AD974ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS					5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	3	2.65 mm	7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD9861BCPZ-80	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3		260	9 mm
ADL5243ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	1 mm	5 mm	Not Qualified	e3	30	260	5 mm
ADRF5045BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V			3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
ADRF5045BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V			3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm		e4	30	260	4 mm
ADV7619KSVZ	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G128	3	1.2 mm	14 mm		e3	20	260	14 mm
FIDO5200BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC1119LP4ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	1 mm	4 mm		e4	30	260	4 mm
HMC263LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC572LC5	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1						3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel	GOLD OVER NICKEL	QUAD	S-XQCC-N32		1.12 mm	5 mm	Not Qualified	e4			5 mm
HMC700LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm		e3	30	260	4 mm
HMC8108LC5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1								CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	1.12 mm	4.9 mm			30	260	4.9 mm
HMC981LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	1	1 mm	3 mm		e3	30	260	3 mm
LTC5596IDC#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS					3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-N8	1	.8 mm	2 mm		e3		260	2 mm
AD7013ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS					5 V	5	SMALL OUTLINE, SHRINK PITCH	SOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified	e0			10.2 mm
AD6437	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	YES	1						5 V		FLATPACK				85 Cel	-40 Cel		QUAD	S-PQFP-G80				Not Qualified
HMC310MS8G	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1				1		3 V	3	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	SSOP8,.19	Network Interfaces	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0		235	3 mm
AD6459ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3 V		SMALL OUTLINE				85 Cel	-40 Cel		DUAL	R-PDSO-G20				Not Qualified
LTP5900IPC-WHMA1A2#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	22	XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.6 V		MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)			85 Cel	-40 Cel		DUAL	R-XDMA-T22
LTC1957-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
AD9081BBPZRL-4D4AC	Analog Devices	TELECOM CIRCUIT
AD7115TD	Analog Devices	TELECOM CIRCUIT																						Tin/Lead (Sn/Pb)							e0
ADF5901WCCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm		e3	30	260	5 mm
HMC701LP6CE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N40	1	.9 mm	6 mm	Not Qualified	e3			6 mm
AD6423	Analog Devices	TELECOM CIRCUIT		GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS							FLATPACK, FINE PITCH			.5 mm				QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified				10 mm
ADF5901WCCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm		e3	30	260	5 mm
AD630AD/+	Analog Devices		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC	NO		BIPOLAR		-15 V		5 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T20					e0
ADL5390ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N24		1 mm	4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
LTC4401-1ES6#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified	e3	30	260	2.9 mm
HMC914LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC745LC3	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N16	3	.9 mm	2.9 mm	Not Qualified	e4	30	260	2.9 mm
ADL5386ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR				.245 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N40		1 mm	6 mm	Not Qualified	e3			6 mm
LTC4402-2EMS#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
AD6458ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR				.022 mA	3.3 V	3/3.3	SMALL OUTLINE	SSOP20,.3	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20				Not Qualified	e0
HMC710LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel		QUAD	S-XQCC-N32		1.12 mm	5 mm					5 mm
HMC749LC3CTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		QUAD	S-CQCC-N16	3	1.31 mm	3 mm			30	260	3 mm
LTC4403-1EMS8#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3		260	3 mm
ADL5354XCPZ-R21	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					5 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N36		1 mm	6 mm	Not Qualified				6 mm
ADL5391ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm	3 mm	Not Qualified	e3	30	260	3 mm
AD6121ACPRL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32		1 mm	5 mm	Not Qualified				5 mm
LTC4401-2EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADL5386ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR				.245 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N40		1 mm	6 mm	Not Qualified	e3			6 mm
HMC705LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN OVER NICKEL	QUAD	S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	40	260	4 mm
ADL5353XCPZ-WP1	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS					5 V		CHIP CARRIER			.65 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N20		.9 mm	5 mm	Not Qualified				5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.