Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
ADRV9008BBCZ-1REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B196	3	1.27 mm		12 mm				260	12 mm
ADRV9008BBCZ-2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B196	3	1.27 mm		12 mm				260	12 mm
ADTR1107ACCZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1				5 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm		5 mm		e4		260	5 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel	0 Cel		Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128	3	1.2 mm		14 mm		e3		260	14 mm
HMC773ALC3BTR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N12		.9 mm		2.9 mm			NOT SPECIFIED	NOT SPECIFIED	2.9 mm
AD8314ARMZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm		3 mm	Not Qualified	e3		260	3 mm
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1				5 V		GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25		.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm		5 mm		e4		260	5 mm
MAX7042ATJ	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0086 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N32	1	.8 mm		5 mm	Not Qualified	e0			5 mm
MAX7042ATJ+	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0092 mA	3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	125 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
ADL5391ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
LTC5596IDC#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm		2 mm		e3			2 mm
AD73311ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified	e0		240	7.2 mm	YES
MAX3799ETJ+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD		S-XQCC-N32	1	.8 mm		5 mm		e3	30	260	5 mm
AD630JN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20						e0
AD73311ARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL		R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified	e3	40	260	7.2 mm	YES
AD8015ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	4.9 mm
SC1894A-00C13E	Analog Devices	TELECOM CIRCUIT		NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm					QUAD		S-XQCC-N64		.9 mm		9 mm			NOT SPECIFIED	NOT SPECIFIED	9 mm
ADV7533BCBZ-RL	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	49	VFBGA	SQUARE	UNSPECIFIED	YES	1	CMOS			1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-10 Cel		TIN SILVER COPPER	BOTTOM		S-XBGA-B49	1	.66 mm		3.46 mm	Not Qualified	e1	30	260	3.46 mm
ADL5904ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm		3 mm		e4	30	260	3 mm
HMC566LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N24	3	1 mm		4 mm	Not Qualified	e3	30	260	4 mm
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM		S-PBGA-B144		1.71 mm		10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
HMC1094LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N16	1	1 mm		3 mm		e3	30	260	3 mm
MAX7033EUI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.00688 mA	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G28	1	1.1 mm		4.4 mm	Not Qualified	e3	30	260	9.7 mm
AD6676BCBZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	80	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.1 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B80	1	.66 mm		5.04 mm		e1	30	260	4.29 mm
AD9864BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	.02 Mbps	S-XQCC-N48	3	1 mm		7 mm		e3	30	260	7 mm
HMC566LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N24	3	1 mm		4 mm		e3	30	260	4 mm
HMC773ALC3B	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TUNGSTEN NICKEL GOLD	QUAD		S-CQCC-N12	3	.92 mm		3 mm				260	3 mm
LTC5800IWR-IPMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		SILVER	QUAD		S-PQCC-N72		1 mm		10 mm		e4			10 mm
AD9670BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	0 Cel			BOTTOM		S-PBGA-B144	3	1.4 mm		10 mm			30	260	10 mm
LTC5596HDC#TRPBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm		2 mm		e3		260	2 mm
AD8312ACBZ-P7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B6	1	.675 mm		.95 mm	Not Qualified	e1	40	260	1.45 mm
HMC8200LP5ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	1 mm		5 mm		e4		260	5 mm
LTC5586IUH#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N32	1	.8 mm		6 mm		e3	30	260	6 mm
MAX2851ITK+T	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		Matte Tin (Sn) - annealed	QUAD		S-XQCC-N68	3	.8 mm		10 mm		e3	30	260	10 mm
AD6624AABCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5,3.3	GRID ARRAY, LOW PROFILE	BGA196,14X14,40	Other Telecom ICs	1 mm	70 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm		15 mm	Not Qualified	e1		260	15 mm
AD8314ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	VSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-XDSO-N8	1	1 mm		2 mm	Not Qualified	e3	30	260	3 mm
ADN2915ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.3774 mA	3.3 V	1.2,1.8/3.3,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N24	3	1 mm		4 mm	Not Qualified	e3			4 mm
LTC5596HDC#TRMPBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		MATTE TIN	DUAL		S-PDSO-N8	1	.8 mm		2 mm		e3		260	2 mm
AD73311LARSZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e3		260	7.2 mm
HMC1122LP4ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N24	3	.95 mm		4 mm					4 mm
HMC625BLP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQCC-N32	3	1 mm		5 mm		e3	30	260	5 mm
LTC5596HDC#PBF	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		S-PDSO-N8	1	.8 mm		2 mm		e3			2 mm
MAX3107ETG+TG3U	Analog Devices																										1						30	260
AD630KN/+	Analog Devices		COMMERCIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO		BIPOLAR	-15 V	.005 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel		Tin/Lead (Sn/Pb)	DUAL		R-PDIP-T20						e0
AD73311ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm		7.5 mm	Not Qualified	e3	30	260	12.8 mm
AD73311ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm		7.5 mm	Not Qualified	e3	30	260	12.8 mm
AD73311LARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		Tin/Lead (Sn85Pb15)	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e0	30	240	7.2 mm
AD73311LARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e3		260	7.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.