Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
ADN2830ACP32-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD	S-XQCC-N32	3	1 mm		5 mm	Not Qualified	e0		240	5 mm
ADRV9004BBCZ-RL	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2					1 V		GRID ARRAY			.8 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B196	3	1.25 mm		12 mm			30	260	12 mm
LTC5100EUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	.8 mm		4 mm	Not Qualified	e3	30	260	4 mm
AD630BD/+	Analog Devices		OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC	NO		BIPOLAR		-15 V	5 mA	15 V	+-15	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	85 Cel	-25 Cel		Tin/Lead (Sn/Pb)	DUAL	R-XDIP-T20						e0
AD8285WBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N72	3	.9 mm		10 mm		e3	30	260	10 mm
HMC-C200	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	5		RECTANGULAR	UNSPECIFIED	NO	1					6.5 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		GOLD OVER NICKEL	UNSPECIFIED	R-XXMA-X5					Not Qualified	e4
HMC1094LP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1	1 mm		3 mm		e3	30	260	3 mm
HMC862ALP3E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	3	1 mm		3 mm		e3	30	260	3 mm
LTC5586IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32		.8 mm		6 mm		e3			6 mm
LTC5587IDD#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVSON	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			.45 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	S-PDSO-N12	1	.8 mm		3 mm	Not Qualified	e3	30	260	3 mm
MAX1472AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0166 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G8	1	1.45 mm		1.625 mm	Not Qualified	e4	30	260	2.9 mm
MAX3120ESA+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	4.9 mm
MAX9152EUE+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified	e3	30	260	5 mm
AD73311AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V	3/5	SMALL OUTLINE	SOP20,.4	Codecs	1.27 mm	85 Cel	-40 Cel	1 dB	TIN LEAD	DUAL	R-PDSO-G20	1	2.65 mm	16-BIT	7.5 mm	Not Qualified	e0		240	12.8 mm	YES
AD73311LARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e0		240	7.2 mm
AD73311LARS-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified	e0		240	7.2 mm
AD73360ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD974BRZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
ADF7023BCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.8 mm		5 mm	Not Qualified	e4	30	260	5 mm
ADF7030-1BCPZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N40	3	.8 mm		6 mm			30	260	6 mm
ADRV9004BBCZ	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2					1 V		GRID ARRAY			.8 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B196	3	1.25 mm		12 mm			30	260	12 mm
MAX9152ESE+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	9.9 mm
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
AD9081BBPZ-4D4AB	Analog Devices	TELECOM CIRCUIT
ADA2200ARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Matte Tin (Sn)	DUAL	R-PDSO-G16	1	1.2 mm		4.4 mm		e3	30	260	5 mm
ADA2200ARUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Tin (Sn)	DUAL	R-PDSO-G16	1	1.2 mm		4.4 mm		e3	30	260	5 mm
ADF7023BCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3 V	2/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	.8 mm		5 mm	Not Qualified	e4	30	260	5 mm
ADN2892ACPZ-500RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
ADRF6516ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm		5 mm		e3		260	5 mm
ADRF6850BCPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			.44 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N56	3	1 mm		8 mm	Not Qualified	e3	30	260	8 mm
HMC625BLP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	3	1 mm		5 mm		e3	30	260	5 mm
LTC5589IUF#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		.5 mm	105 Cel	-40 Cel		MATTE TIN	QUAD	R-PQCC-N24		.8 mm		6 mm		e3			6 mm
MAX2510EEI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				25 mA	3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.75 mm		3.9 mm	Not Qualified	e3	30	260	9.89 mm
MAX7037EGL+	Analog Devices	TELECOM CIRCUIT																						NICKEL GOLD PALLADIUM			1						30	260
AD73322LARUZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			.031 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Codecs	.65 mm	85 Cel	-40 Cel	.75 dB	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G28	1	1.2 mm	16-BIT	4.4 mm	Not Qualified	e3	40	260	9.7 mm	YES
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified	e3	30	260	17.9 mm
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3		260	3 mm
ADN2892ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N16	3	.9 mm		3 mm	Not Qualified	e3	30	260	3 mm
HMC560LM3	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	6	HQCCN	SQUARE	PLASTIC/EPOXY	YES	1							CHIP CARRIER, HEAT SINK/SLUG			1 mm	85 Cel	-55 Cel		GOLD OVER NICKEL	QUAD	S-PQCC-N6	1	1.14 mm		5.08 mm	Not Qualified	e4		250	5.08 mm
HMC572LC5TR	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					3.5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel	-55 Cel			QUAD	S-XQCC-N32		1.12 mm		5 mm			NOT SPECIFIED	NOT SPECIFIED	5 mm
LT5575EUF	Analog Devices		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES					155 mA	5 V	5	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		Tin/Lead (Sn/Pb)	QUAD	S-PQCC-N16					Not Qualified	e0
LTC4400-1ES6#TRMPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G6	1	1 mm		1.6 mm	Not Qualified	e3			2.9 mm
LTC5800IWR-IPRB#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		SILVER	QUAD	S-PQCC-N72		1 mm		10 mm		e4			10 mm
MAX5980AGTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm		5 mm		e3	30	260	5 mm
ADL5506ACBZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,16		.4 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	R-PBGA-B6	1	.56 mm		.79 mm		e1	30	260	1.19 mm
LT5554IUH#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N32	1	.8 mm		5 mm	Not Qualified	e3	30	260	5 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified	e3		260	10.2 mm
AD9856ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified	e3	30	260	7 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.