Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADF5709BEZ	Analog Devices	TELECOM CIRCUIT		NO LEAD	24	QCCN	SQUARE	CERAMIC	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N24		1.2 mm	3.9 mm					3.9 mm
AD7010ARS-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified	e0			8.2 mm
HMC496LP3TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e0		235	3 mm
ADL5390ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N24	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
HMC756	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	5	DIE	RECTANGULAR	UNSPECIFIED	YES	1					7 V		UNCASED CHIP				85 Cel	-40 Cel		UPPER		R-XUUC-N5				Not Qualified
ADP5589ACBZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.56 mm	1.99 mm		e1	30	260	1.99 mm
ADM1041ARQ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e0		240	8.6614 mm
AD28MSP500CHIPSET	Analog Devices
ADM1041AARQZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3	30	260	8.6614 mm
LTC4400-1ES6#TRM	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified	e0			2.9 mm
ADAR1000	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1					3.3 V		GRID ARRAY, HEAT SINK/SLUG	LGA88,13X13,20		.5 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B88		.8 mm	7 mm					7 mm
LT5500EGN#TRPBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.727 mm	3.899 mm	Not Qualified	e3		260	8.649 mm
LTP5902IPC-IPMAXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66	XMA	RECTANGULAR	UNSPECIFIED	NO	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N66			24 mm			NOT SPECIFIED	NOT SPECIFIED	37.465 mm
HMC737LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e3	30	260	4 mm
AD6421AST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3 V	3	FLATPACK, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm	Not Qualified				10 mm
AD6121ARSRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	UNSPECIFIED	YES	1	BICMOS				3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-XDSO-G28		1.98 mm	5.3 mm	Not Qualified	e0			10.2 mm
LTC1957-1EMS8#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
AD6679BBPZ-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.25 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.49 mm	12 mm		e1	30	260	12 mm
HMC745LC3TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-CQCC-N16	3	.9 mm	2.9 mm			30	260	2.9 mm
AD6684BCPZ-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1					.975 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm			MATTE TIN	QUAD		S-XQCC-N72	3	1 mm	10 mm		e3	30	260	10 mm
ADA4961ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N24	3	.8 mm	4 mm		e4	30	260	4 mm
LTM9004IV-AD#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm	15 mm	Not Qualified	e4			22 mm
IA8251-PDW28C	Analog Devices
LTM9004CV-AB#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm	15 mm	Not Qualified	e4			22 mm
ADF5901ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm			30	260	5 mm
LTC4401-1ES6#TR	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified	e0			2.9 mm
AD9950TJ	Analog Devices	TELECOM CIRCUIT	MILITARY	J BEND	68	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	BIPOLAR		-5.2 V	.054 mA	5 V	5,-5.2	CHIP CARRIER	LDCC68,1.0SQ	Other Telecom ICs	1.27 mm	125 Cel	-55 Cel	TIN LEAD	QUAD		S-CQCC-J68				Not Qualified	e0
LT1328CS8#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G8		1.752 mm	3.9 mm	Not Qualified	e3			4.9 mm
ADSP-21MOD980-000	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				2.75 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM		S-PBGA-B352		2.62 mm	35 mm	Not Qualified	e0			35 mm
AD6674BCPZ-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm		e3		260	9 mm
HMC773LC3B	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N12	3	.92 mm	3 mm	Not Qualified	e4		260	3 mm
LTP5902IPC-IPMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66		RECTANGULAR	UNSPECIFIED	YES	1					3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N66	3	3.54 mm	24 mm			30	250	37.5 mm
LTM9004IV-AB#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm	15 mm	Not Qualified	e4			22 mm
HMC739LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-N24	1	1 mm	4 mm		e3	30	260	4 mm
ADL5904	Analog Devices	TELECOM CIRCUIT	MILITARY	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1							CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	125 Cel	-55 Cel		QUAD		S-XQCC-N16		.8 mm	3 mm					3 mm
AD6622AS	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	-40 Cel		QUAD		R-PQFP-G128		3.4 mm	14 mm	Not Qualified				20 mm
HMC737LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					4.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
ADF5904ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm		e3	30	260	5 mm
LTC1757A-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADF5902WCCPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm				260	5 mm
ADF5901ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1					3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm			30	260	5 mm
LT5517EUF#PBF	Analog Devices		INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES					110 mA	5 V	5	CHIP CARRIER	LCC16,.16SQ,25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQCC-N16	1			Not Qualified	e3	30	260
LTP5903IPC-WHRCXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES						5 V		UNCASED CHIP	DIE OR CHIP			85 Cel	-40 Cel		UPPER	.25 Mbps	R-XUUC-N		19.685 mm	102.87 mm			NOT SPECIFIED	NOT SPECIFIED	55.626 mm
FIDO5110CBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS				1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32		.8 mm	105 Cel	-40 Cel		BOTTOM		S-PBGA-B144		1.24 mm	10 mm			NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9993BBCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	12 mm					12 mm
ADP5585ACPZ-01-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1					1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e3	30	260	3 mm
ADP5589ACBZ-02-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1					1.8 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B25	1	.56 mm	1.99 mm		e1	30	260	1.99 mm
AD8285WBCPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS	AEC-Q100			1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N72	3	.9 mm	10 mm		e3	30	260	10 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.