Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
80 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
S-XQCC-N80 |
.9 mm |
11 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
355 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
10 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
TIN LEAD |
UPPER |
R-XUUC-N10 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
380 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
355 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
380 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NO LEAD |
80 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
QUAD |
S-XQCC-N80 |
.9 mm |
11 mm |
NOT SPECIFIED |
NOT SPECIFIED |
11 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
355 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N16 |
1 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
380 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
355 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
20 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
UNCASED CHIP |
70 Cel |
0 Cel |
TIN LEAD |
UPPER |
R-XUUC-N20 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
Not Qualified |
e0 |
||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
20 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BICMOS |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N20 |
1 |
.8 mm |
5 mm |
e3 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
355 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
380 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
380 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.8 mm |
5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
|||||||||||||||||||||||||||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
HSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.084 mA |
3.3 V |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
SSOP16,.25 |
Other Telecom ICs |
.635 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.58 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
16 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.099 mA |
3.3 V |
3.3 |
CHIP CARRIER, VERY THIN PROFILE |
LCC16,.16SQ,25 |
ATM/SONET/SDH ICs |
.65 mm |
85 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQCC-N16 |
1 mm |
4 mm |
Not Qualified |
e0 |
4 mm |
||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.1 mm |
4.4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
5 mm |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
380 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
Matte Tin (Sn) - annealed |
1 |
e3 |
30 |
260 |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N16 |
1 |
.8 mm |
3 mm |
e3 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
42 |
DIP |
RECTANGULAR |
NO |
110 mA |
5 V |
5 |
IN-LINE |
DIP42,1.8 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-XDIP-T42 |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
COMMERCIAL |
J BEND |
44 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC44,.7SQ |
Other Telecom ICs |
1.27 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-J44 |
CEPT PCM-30/E-1 |
Not Qualified |
e3 |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
5 V |
5 |
IN-LINE |
DIP40,.6 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
TIN LEAD |
DUAL |
R-PDIP-T40 |
T-1(DS1) |
Not Qualified |
e0 |
|||||||||||||||||||||||||||||||||||||||||
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
95 Cel |
-40 Cel |
QUAD |
S-XQCC-N32 |
.8 mm |
5 mm |
5 mm |
||||||||||||||||||||||||||||||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
196 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G8 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e3 |
30 |
260 |
4.9 mm |
|||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
68 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
BIPOLAR |
.58 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC68,.4SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-XQCC-N68 |
3 |
.9 mm |
10 mm |
Not Qualified |
e3 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
1.27 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B272 |
2.34 mm |
27 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
27 mm |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
355 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
196 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||
Analog Devices |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
70 Cel |
0 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G16 |
1 |
1.73 mm |
3.9 mm |
Not Qualified |
e3 |
4.89 mm |
|||||||||||||||||||||||||||||||||||||||
|
Analog Devices |
INDUSTRIAL |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
187 mA |
3.3 V |
3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Other Telecom ICs |
T-3(DS3) |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQFP-G100 |
STS-1/OC-1 |
E-3 |
Not Qualified |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.