Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD9364BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.7 mm		10 mm			e1	30	260	10 mm
AD9364BBCZREEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B144	3	1.7 mm		10 mm			e1	30	260	10 mm
MAX5980GTJ+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			54 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N32	1	.8 mm		5 mm			e3	30	260	5 mm
HMC624ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N24	1	.9 mm		4 mm			e3		260	4 mm
ADL5350ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	RECTANGULAR	UNSPECIFIED	YES	1				3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-XDSO-N8	1	1 mm		2 mm	Not Qualified		e3		260	3 mm
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B144	3	1.7 mm		10 mm				30	260	10 mm
AD9874ABSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48		1.6 mm		7 mm	Not Qualified		e3			7 mm
ADAR1000ACCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		-5 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B88	3	.8 mm		7 mm					260	7 mm
ADAR1000ACCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1		-5 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B88		.8 mm		7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel	-40 Cel			BOTTOM	S-PBGA-B196	3	1.19 mm		12 mm				30	260	12 mm
MAX2771ETI+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			2.85 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20		.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-XQCC-N28	1	.8 mm		5 mm			e3	30	260	5 mm
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32		.8 mm	110 Cel	-40 Cel			BOTTOM	S-PBGA-B196	3	1.19 mm		12 mm				30	260	12 mm
HMC624ALP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-PQCC-N24	1	1 mm		4 mm			e3		260	4 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B144	3	1.7 mm		10 mm				30	260	10 mm
ADRV9009BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.27 mm		12 mm			e1		260	12 mm
MAX3946ETG+T	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD	S-XQCC-N24	1	.8 mm		4 mm			e3	30	260	4 mm
ADRV9009BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.27 mm		12 mm			e1		260	12 mm
AD9874ABSTRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified		e3	30	260	7 mm
MAX2769CETI+	Analog Devices	TELECOM CIRCUIT																					Matte Tin (Sn) - annealed			1						e3	30	260
AD9874ABST	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS			3 V	3/3.3,3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified		e3	30	260	7 mm
HMC641ALP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		-5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	3	1 mm		4 mm			e3		260	4 mm
AD9832BRUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e3	30	260	5 mm
AD9832BRUZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 mA	3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	1.1 mm		4.4 mm	Not Qualified		e3	30	260	5 mm
HMC1122LP4METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N24	3	.95 mm		4 mm						4 mm
ADRF5044BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1		-3.3 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm		4 mm			e4	30	260	4 mm
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	0 Cel			BOTTOM	S-PBGA-B144	3	1.4 mm		10 mm				30	260	10 mm
ADRF5044BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1		-3.3 V		3.3 V		GRID ARRAY, HEAT SINK/SLUG			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm		4 mm			e4	30	260	4 mm
HMC641ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		-3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD	S-XQCC-N24		.95 mm		4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
HMC773ALC3BTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		GOLD OVER NICKEL	QUAD	S-CQCC-N12	3	.92 mm		3 mm			e4			3 mm
LTC5596IDC#TRMPBF	Analog Devices	TELECOM CIRCUIT		NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm				MATTE TIN	DUAL	S-PDSO-N8		.8 mm		2 mm			e3			2 mm
MAX5980GTJ+	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1	CMOS					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		Matte Tin (Sn) - annealed	QUAD	S-CQCC-N32	1	.8 mm		5 mm			e3	30	260	5 mm
AD73311ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Codecs	.65 mm	85 Cel	-40 Cel	1 dB	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	16-BIT	5.3 mm	Not Qualified		e3		260	7.2 mm	YES
ADF7012BRUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified		e3	30	260	7.8 mm
HMC799LP3ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	QCCN	SQUARE	PLASTIC/EPOXY	YES	1			80 mA	5 V	5	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N16	1				Not Qualified		e3	30	260
ADRV9026BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B289	3	1.46 mm		14 mm		ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
AD8015AR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		TIN LEAD	DUAL	R-PDSO-G8	1	1.75 mm		3.9 mm	Not Qualified		e0		240	4.9 mm
AD608ARZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified		e3	30	260	9.9 mm
HMC244AG16	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V		FLATPACK, LOW PROFILE			.76 mm	85 Cel	-40 Cel		GOLD OVER NICKEL	QUAD	S-PQFP-G16	1	1.65 mm		5.84 mm			e4	30	250	5.84 mm
HMC980LP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	1 mm		4 mm			e3	30	260	4 mm
ADRV9026BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4				1 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32		.8 mm	110 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM	S-PBGA-B289	3	1.46 mm		14 mm		ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
AD8015ARZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			26 mA	5 V		SMALL OUTLINE				85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G8	1				Not Qualified		e3	30	260
ADRV9008BBCZ-1	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel			BOTTOM	S-PBGA-B196	3	1.27 mm		12 mm					260	12 mm
MAX2769CETI+T	Analog Devices	TELECOM CIRCUIT																					Matte Tin (Sn) - annealed			1						e3	30	260
MAX7044AKA+T	Analog Devices	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	8	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0257 mA	2.7 V	2.7	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSSOP8,.1	Other Telecom ICs	.65 mm	125 Cel	-40 Cel		NICKEL GOLD PALLADIUM	DUAL	R-PDSO-G8	1	1.45 mm		1.625 mm	Not Qualified			30	260	2.9 mm
ADF7012BRUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified		e3	30	260	7.8 mm
HMC980LP4E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				12 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD	S-PQCC-N24	1	1 mm		4 mm	Not Qualified		e3	30	260	4 mm
HMC1119LP4METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	1 mm		4 mm			e4	30	260	4 mm
ADRV9003BBCZ	Analog Devices	TELECOM CIRCUIT																															NOT SPECIFIED	NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.