Analog Devices Other Function Telecom Interface ICs 1,164

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD6623ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.5 mm	15 mm	Not Qualified	e1		260	15 mm
ADA4961ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N24		.8 mm	4 mm					4 mm
LTC4403-2EMS#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e0			3 mm
ADL5246ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N32	3	.8 mm	5 mm		e4	30	260	5 mm
AD7011ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24		2 mm	5.3 mm	Not Qualified	e0			8.2 mm
AD6422AST	Analog Devices	TELECOM CIRCUIT		GULL WING	144	FQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			FLATPACK, FINE PITCH			.5 mm				QUAD		S-PQFP-G144		1.6 mm	20 mm	Not Qualified				20 mm
LTC1757A-2EMS	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	DUAL		S-PDSO-G10	1	1.17 mm	3 mm	Not Qualified	e0			3 mm
IA6850-PDW24I	Analog Devices
LTM9004CV-AD#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	204	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		5 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	GOLD	BOTTOM		R-PBGA-N204		2.97 mm	15 mm	Not Qualified	e4			22 mm
LTP5903IPC-WHRBXXX#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES			5 V		UNCASED CHIP	DIE OR CHIP			85 Cel	-40 Cel		UPPER	.25 Mbps	R-XUUC-N		19.685 mm	102.87 mm			NOT SPECIFIED	NOT SPECIFIED	55.626 mm
AD6122ACPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N32		1 mm	5 mm	Not Qualified	e0			5 mm
ADL5354ACPZ-R2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N36	1	1 mm	6 mm	Not Qualified	e3			6 mm
LTC4401-1ES6#TRM	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	6	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3.6 V		SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH			.95 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G6	1	1 mm	1.6 mm	Not Qualified	e0			2.9 mm
HMC712	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1				UNCASED CHIP				85 Cel	-55 Cel	GOLD	UPPER		R-XUUC-N			1.204 mm		e4			1.414 mm
ADP5585ACPZ-03-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e3	30	260	3 mm
LTC1957-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
ADL5335ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	4 mm		e4	30	260	4 mm
ADRF6820ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N40		.8 mm	6 mm			NOT SPECIFIED	NOT SPECIFIED	6 mm
AD6674BCPZRL7-750	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1.25 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N64	3	.8 mm	9 mm		e3		260	9 mm
AD1803JRU-REEL	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	0 Cel	TIN LEAD	DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm
LT5500EGN#TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.727 mm	3.899 mm	Not Qualified	e0			8.649 mm
HMC737LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e0			4 mm
IA6850-PDW24C	Analog Devices
AD6652BBC	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN LEAD SILVER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified	e0		240	17 mm
AD6121ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	UNSPECIFIED	YES	1	BICMOS	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-XDSO-G28		1.98 mm	5.3 mm	Not Qualified	e0			10.2 mm
HMC773	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	3	DIE	RECTANGULAR	UNSPECIFIED	YES	1				UNCASED CHIP				85 Cel	-55 Cel		UPPER		R-XUUC-N3				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
AD6459ARS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		3 V		SMALL OUTLINE				85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G20				Not Qualified	e0
AD9993BBCZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.4 mm	12 mm			30	260	12 mm
ADM1041AARQZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e3		260	8.6614 mm
HMC736LP4TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-PQCC-N24		1 mm	4 mm					4 mm
AD6623AS	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified	e0		240	20 mm
FIDO2100PLQ128IR0	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		1.8 V		FLATPACK, LOW PROFILE, FINE PITCH			.4 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G128		1.6 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
ADP5585ACPZ-00-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	.8 mm	3 mm		e3	30	260	3 mm
LTC1758-1EMS8#PBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel	0 Cel	Matte Tin (Sn)	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
AD6623ASZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified	e3		260	20 mm
HMC496LP3	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e0		235	3 mm
LTC1758-2EMS#TRPBF	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		3.6 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel	0 Cel	MATTE TIN	DUAL		S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
AD6426XB	Analog Devices		OTHER	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES		BIPOLAR		2.4/3.3	GRID ARRAY	BGA144,12X12,40	Other Telecom ICs	1 mm	85 Cel	-25 Cel	Tin/Lead (Sn/Pb)	BOTTOM		S-PBGA-B144				Not Qualified	e0
AD974ANZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS	5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDIP-T28		5.33 mm	7.62 mm	Not Qualified	e3			36.687 mm
AD6121ACPRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-XQCC-N32		1 mm	5 mm	Not Qualified	e0			5 mm
LTP5901IPC-IPMA#PBF	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	66		RECTANGULAR	UNSPECIFIED	YES	1		3.6 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel	MATTE TIN	UNSPECIFIED		R-XXMA-N66		3.54 mm	24 mm		e3			42 mm
ADL5353ACPZ-WP	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	5 mm	Not Qualified	e3			5 mm
ADM1041ARQ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.7526 mm	3.9116 mm	Not Qualified	e0		240	8.6614 mm
AD1803JRUZ-REEL	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel	0 Cel	MATTE TIN	DUAL		R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified	e3		260	7.8 mm
HMC736LP4	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		4.2 V		CHIP CARRIER			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQCC-N24	1	1 mm	4 mm	Not Qualified	e0			4 mm
IA6850	Analog Devices
ADRF5519BCPZN-R7	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADL5605ACPZ-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N16	3	1 mm	4 mm	Not Qualified	e3	30	260	4 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.