NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

935330039534

NXP Semiconductors

TELECOM CIRCUIT

MC33742SPEG/R2

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

5.5/18

SMALL OUTLINE

Network Interfaces

1.27 mm

125 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G28

3

2.65 mm

7.5 mm

Not Qualified

e3

40

260

17.925 mm

935300302115

NXP Semiconductors

TELECOM CIRCUIT

935304625118

NXP Semiconductors

TELECOM CIRCUIT

MC33696FJE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G32

3

1.6 mm

5 mm

e3

40

260

5 mm

935309327557

NXP Semiconductors

TELECOM CIRCUIT

3

40

260

935336587012

NXP Semiconductors

TELECOM CIRCUIT

MC12311CHNR

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

60

LGA

SQUARE

PLASTIC/EPOXY

YES

2/3.3

GRID ARRAY

LGA60,16X16,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

S-PBGA-N60

3

Not Qualified

e4

40

260

HT1ICS3002W/V9F

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

5

DIE

RECTANGULAR

UNSPECIFIED

YES

1

3.5 V

UNCASED CHIP

85 Cel

-40 Cel

UPPER

R-XUUC-N5

935300802518

NXP Semiconductors

TELECOM CIRCUIT

935320806147

NXP Semiconductors

TELECOM CIRCUIT

935290255115

NXP Semiconductors

TELECOM CIRCUIT

HTMS8201FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

935289286118

NXP Semiconductors

TELECOM CIRCUIT

935307917518

NXP Semiconductors

TELECOM CIRCUIT

HTSFCH3201EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

MC33596FCE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

40

260

5 mm

HTSICH4801EW/V4,00

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

935306214518

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD SILVER

2

e4

30

260

MC33742SPEG

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

28

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.045 mA

5.5/18

SMALL OUTLINE

SOP28,.4

Network Interfaces

1.27 mm

125 Cel

-40 Cel

TIN

DUAL

1 Mbps

R-PDSO-G28

3

Not Qualified

e3

40

260

HT2DC20S20/F,122

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

SPECIAL SHAPE

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-PXSS-N

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

935374228557

NXP Semiconductors

TELECOM CIRCUIT

TIN

3

e3

40

260

HTSMOH5602EV

NXP Semiconductors

TELECOM CIRCUIT

MC33696FCE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

3

1 mm

5 mm

40

260

5 mm

935304624118

NXP Semiconductors

TELECOM CIRCUIT

HT2DC20S20

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

RECTANGULAR

PLASTIC/EPOXY

YES

1

HYBRID

SPECIAL SHAPE

MODULE(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

UNSPECIFIED

R-PXSS-N

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

HTSMOH4802EV

NXP Semiconductors

TELECOM CIRCUIT

HTMS8301FTB/AF

NXP Semiconductors

TELECOM CIRCUIT

BUTT

3

RECTANGULAR

PLASTIC/EPOXY

YES

CHIP CARRIER

BOTTOM

R-PBCC-B3

Not Qualified

935293448115

NXP Semiconductors

TELECOM CIRCUIT

935289286115

NXP Semiconductors

TELECOM CIRCUIT

935306219551

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD SILVER

2

e4

30

260

935296437115

NXP Semiconductors

TELECOM CIRCUIT

935293449115

NXP Semiconductors

TELECOM CIRCUIT

HT1ICS3002W/V6F

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

RECTANGULAR

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-XUUC-N

HTMS8301FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

935330037534

NXP Semiconductors

TELECOM CIRCUIT

935312711574

NXP Semiconductors

TELECOM CIRCUIT

TIN

3

e3

40

260

JN5168-001-M00

NXP Semiconductors

TELECOM CIRCUIT

JN5168-001-M05Z

NXP Semiconductors

TELECOM CIRCUIT

3

240

935302613557

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

935292114557

NXP Semiconductors

TELECOM CIRCUIT

HTMS8301FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

MC13055D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

3.9 mm

9.9 mm

935297333157

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

935289272115

NXP Semiconductors

TELECOM CIRCUIT

935301561003

NXP Semiconductors

TELECOM CIRCUIT

935306208518

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD SILVER

2

e4

30

260

HTMS8201FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

1

Not Qualified

260

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.