NXP Semiconductors Other Function Telecom Interface ICs 1,402

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

935293911151

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

1

e4

30

260

935318957528

NXP Semiconductors

TELECOM CIRCUIT

TIN

3

e3

40

260

935308986518

NXP Semiconductors

TELECOM CIRCUIT

HTMS8101FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

935299852157

NXP Semiconductors

TELECOM CIRCUIT

HTSMOH4801EV,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

SILVER

UPPER

X-XUUC-N

Not Qualified

e4

CGY2110CU

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

13

DIE

RECTANGULAR

UNSPECIFIED

YES

1

GAAS

.1 mA

5.7 V

5.7

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-10 Cel

UPPER

R-XUUC-N13

Not Qualified

935323222557

NXP Semiconductors

TELECOM CIRCUIT

NICKEL GOLD

3

e4

40

260

935295976557

NXP Semiconductors

TELECOM CIRCUIT

HTMS1201FTB/AF,118

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

3

QCCN

PLASTIC/EPOXY

YES

CMOS

CHIP CARRIER

LCC3(UNSPEC)

Other Telecom ICs

QUAD

Not Qualified

935299852151

NXP Semiconductors

TELECOM CIRCUIT

HTSICH4801EW/V4

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTMS8301FUG/AM

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

5

SQUARE

UNSPECIFIED

YES

UNCASED CHIP

UPPER

S-XUUC-N5

Not Qualified

HTMS1301FTK/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

LCC2(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N2

1 mm

2 mm

Not Qualified

3 mm

HTMS1201FTB/AF,115

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

3

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

SMALL OUTLINE, VERY THIN PROFILE

LCC3(UNSPEC)

Other Telecom ICs

85 Cel

-40 Cel

DUAL

R-PDSO-N3

.5 mm

1 mm

Not Qualified

1.45 mm

MC33696FJAER2

NXP Semiconductors

TELECOM CIRCUIT

OTHER

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-20 Cel

QUAD

S-PQFP-G32

1.6 mm

5 mm

40

260

5 mm

HTMS1301FUG/AM,005

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

DIE

SQUARE

UNSPECIFIED

YES

1

CMOS

UNCASED CHIP

85 Cel

-40 Cel

UPPER

S-XUUC-N

935331074003

NXP Semiconductors

TELECOM CIRCUIT

935318841557

NXP Semiconductors

TELECOM CIRCUIT

TIN

3

e3

40

260

935351717118

NXP Semiconductors

TELECOM CIRCUIT

TIN SILVER COPPER

1

e1

30

260

935289272118

NXP Semiconductors

TELECOM CIRCUIT

MC12311

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

BUTT

60

VFLGA

SQUARE

UNSPECIFIED

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-XBGA-B60

.98 mm

8 mm

8 mm

935296854518

NXP Semiconductors

TELECOM CIRCUIT

935290254115

NXP Semiconductors

TELECOM CIRCUIT

935351718518

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

HTMS8001FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

HTSFCH3201EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

MMDS09254HT1

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.23,20

.5 mm

150 Cel

TIN

QUAD

S-PQCC-N32

3

.9 mm

6 mm

e3

40

260

6 mm

935297333151

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-25 Cel

QUAD

1 Mbps

S-PQCC-N32

1 mm

5 mm

5 mm

HTCICC6402FUG/AM,0

NXP Semiconductors

TELECOM CIRCUIT

5 V

5

DIE OR CHIP

Other Telecom ICs

Not Qualified

935313448557

NXP Semiconductors

TELECOM CIRCUIT

3

40

260

MC33596FJER2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

32

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQFP-G32

3

1.6 mm

5 mm

e3

40

260

5 mm

935290136115

NXP Semiconductors

TELECOM CIRCUIT

HTSFCH4801EV/DH

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

2

DIE

RECTANGULAR

METAL

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

R-MUUC-N2

Not Qualified

935312711518

NXP Semiconductors

TELECOM CIRCUIT

TIN

3

e3

40

260

HTSFCH5601EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

UPPER

X-XUUC-N

Not Qualified

e4

HTMS1201FTK/AF

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

2

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N2

Not Qualified

MC33696FCER2

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

5 mm

935301565005

NXP Semiconductors

TELECOM CIRCUIT

935302645557

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

MMDS36254HT1

NXP Semiconductors

TELECOM CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.23,20

.5 mm

150 Cel

TIN

QUAD

S-PQCC-N32

3

.9 mm

6 mm

e3

40

260

6 mm

MC13155D

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

sop16,.24

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

1.75 mm

4.9 mm

9.9 mm

HTSMOH3201EV

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

JN5179-001-M10Z

NXP Semiconductors

TELECOM CIRCUIT

3

240

MC33MR2001RVK

NXP Semiconductors

TELECOM CIRCUIT

AUTOMOTIVE

BALL

85

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B85

3

1.02 mm

6 mm

e1

40

260

6 mm

935302613518

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

JN5139-001-M/02R1V

NXP Semiconductors

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

41

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N41

18 mm

41 mm

HT1MOA3S30/E/3

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

RECTANGULAR

UNSPECIFIED

NO

1

2.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-X

Not Qualified

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.