Renesas Electronics Other Function Telecom Interface ICs 686

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Negative Supply Voltage	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
F0453BLEGK8	Renesas Electronics	TELECOM CIRCUIT																				Tin (Sn)				3				e3	NOT SPECIFIED	260
X9470V24I	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.025 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e0			7.8 mm
82V3255TF8	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK				85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G64	3				e0	30	240
UPD65706(1155FLIP-CHIP)	Renesas Electronics
P9020-NTGI	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	0 Cel		QUAD		S-XQCC-N56		.8 mm	7 mm					7 mm
HC1-55536-7	Renesas Electronics		COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	CERAMIC	NO		CMOS		1.5 mA	5 V	5	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-XDIP-T14					e0
HSP50210JI-52Z	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			.225 mA	5 V	5	CHIP CARRIER	LDCC84,1.2SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQCC-J84	4	4.57 mm	29.31 mm	Not Qualified	e3	30	245	29.31 mm
HSP50110JI-52	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	J BEND	84	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQCC-J84	4	4.57 mm	29.31 mm	Not Qualified	e0			29.31 mm
ZWIR4512AC1WA	Renesas Electronics	TELECOM CIRCUIT																				TIN LEAD				4				e0		260
X9522V20IZ-B	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL		R-PDSO-G20		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	6.5 mm
IDT82V3002PVG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e3			18.415 mm
82P33914-1	Renesas Electronics	TELECOM CIRCUIT
TSI574-10GCLYZ	Renesas Electronics
UPD98411	Renesas Electronics
UPD65703(500TBGA)	Renesas Electronics
IDT82V3255TFG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
QLX4600LIQT7	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	46	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V	1.2	CHIP CARRIER	LCC46,.16X.28,16	Other Telecom ICs	.4 mm	70 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD		R-PQCC-N46	1	.75 mm	4 mm	Not Qualified	e4	30	260	7 mm
8A34004E-DDDNBG8	Renesas Electronics	TELECOM CIRCUIT
UPD98413	Renesas Electronics
RC32614A000GBB#BC0	Renesas Electronics	TELECOM CIRCUIT																				TIN SILVER COPPER				3				e1		260
ISL5571AIB-T	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIMOS			5 V	5,-48	SMALL OUTLINE	SOP16,.4	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	DUAL		R-PDSO-G16	4	2.65 mm	7.5 mm	Not Qualified	e0			10.3 mm
IXP3114	Renesas Electronics
82V3001APVG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	56	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL		R-PDSO-G56	1	2.794 mm	7.5 mm	Not Qualified	e3	30	260	18.415 mm
UPC8215TU-E2	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	8	VSON	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V		SMALL OUTLINE, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel		DUAL		S-PDSO-N8		.53 mm	2 mm					2 mm
EXE8602-DNT	Renesas Electronics																					TIN								e3
UPD65712(756ABGA)	Renesas Electronics
HXR6101-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	SQUARE	UNSPECIFIED	YES	1				3.3 V		UNCASED CHIP				85 Cel	0 Cel	TIN	UPPER		S-XUUC-N	1				e3
92HD92B1X5NLGXYYX8	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm		e3			7 mm
ISL36111DRZ-T7	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
PHS6903	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL EXTENDED	GULL WING	32	QFP	SQUARE	PLASTIC/EPOXY	YES	1		-5.2 V				FLATPACK			1.27 mm	80 Cel	-10 Cel		QUAD		S-PQFP-G32		2.85 mm	12 mm	Not Qualified				12 mm
RA81F5268STGBX#KC0	Renesas Electronics	TELECOM CIRCUIT																				TIN SILVER COPPER								e1		260
TW3801-TC1-CRT	Renesas Electronics																					MATTE TIN				3				e3
HSP50214BVCZ	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	120	QFP	SQUARE	PLASTIC/EPOXY	YES	1				5 V		FLATPACK			.8 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQFP-G120	3	4.07 mm	28 mm	Not Qualified	e3	30	245	28 mm
82V3255EDG	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G64	3	1.2 mm	10 mm	Not Qualified	e3		260	10 mm
UPD98402	Renesas Electronics
ZWIR4512AC1WI	Renesas Electronics	TELECOM CIRCUIT																				TIN LEAD				4				e0		260
QLX111RIQT7	Renesas Electronics	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V	1.2	CHIP CARRIER	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e3	30	260	3 mm
82V3285EQG8	Renesas Electronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				528 mA	3.3 V	3.3	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G100	3			Not Qualified	e3	30	260
UPD65701(352TBGA)	Renesas Electronics
P9025A-XAWGI8	Renesas Electronics
HXR8204-DNT	Renesas Electronics	TELECOM CIRCUIT	OTHER	NO LEAD		DIE	RECTANGULAR	UNSPECIFIED	YES	1						UNCASED CHIP	DIE OR CHIP			85 Cel	0 Cel	TIN	UPPER	28000 Mbps	R-XUUC-N					e3
HXR14100-DNU	Renesas Electronics	TELECOM CIRCUIT																				Tin (Sn)								e3	NOT SPECIFIED	NOT SPECIFIED
IXP3104	Renesas Electronics
CX6140(256LBGA)	Renesas Electronics
UPD65702(500TBGA)	Renesas Electronics
ZWIR4532-S001	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	43	LGA	RECTANGULAR	UNSPECIFIED	YES	1						GRID ARRAY			1.6 mm	85 Cel	-40 Cel		BOTTOM		R-XBGA-N43		2.25 mm	12 mm					15.6 mm
UPD72101	Renesas Electronics
HSP50214BVI	Renesas Electronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	120	QFP	SQUARE	PLASTIC/EPOXY	YES	1			.42 mA	5 V	5	FLATPACK	QFP120,1.2SQ,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel	TIN LEAD	QUAD		S-PQFP-G120	4	4.07 mm	28 mm	Not Qualified	e0			28 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.