Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
TELECOM CIRCUIT |
OTHER |
BALL |
98 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
GRID ARRAY |
85 Cel |
0 Cel |
TIN |
BOTTOM |
R-PBGA-B98 |
3 |
e3 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
Tin/Silver/Copper (Sn/Ag/Cu) |
3 |
e1 |
NOT SPECIFIED |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
9 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B9 |
1 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
1 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.7 mm |
105 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N28 |
1 |
1 mm |
6 mm |
e3 |
NOT SPECIFIED |
260 |
6 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
TIN LEAD |
4 |
e0 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
Tin (Sn) |
e3 |
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Renesas Electronics |
TELECOM CIRCUIT |
Tin/Silver/Copper (Sn/Ag/Cu) |
3 |
e1 |
NOT SPECIFIED |
260 |
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Renesas Electronics |
INDUSTRIAL |
NO LEAD |
48 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.5,3 |
CHIP CARRIER |
LCC48,.27SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N48 |
Not Qualified |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-N68 |
3 |
1 mm |
10 mm |
Not Qualified |
e3 |
10 mm |
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Renesas Electronics |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER |
.5 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
FLATPACK, LOW PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
20 |
240 |
14 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
MATTE TIN |
3 |
e3 |
30 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
3.3 V |
FIBER OPTIC |
UNSPECIFIED |
X-XXFO-X |
Not Qualified |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
208 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B208 |
3 |
Not Qualified |
e0 |
30 |
225 |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.225 mA |
5 V |
5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-J84 |
4 |
4.57 mm |
29.31 mm |
Not Qualified |
e0 |
29.31 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
TELECOM CIRCUIT |
TIN |
3 |
e3 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
MATTE TIN |
3 |
e3 |
30 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
MATTE TIN |
3 |
e3 |
30 |
260 |
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Renesas Electronics |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
UNCASED CHIP |
DIE OR CHIP |
85 Cel |
0 Cel |
TIN |
UPPER |
28000 Mbps |
R-XUUC-N |
e3 |
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Renesas Electronics |
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Renesas Electronics |
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Renesas Electronics |
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Renesas Electronics |
TELECOM CIRCUIT |
TIN |
e3 |
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Renesas Electronics |
TELECOM CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
80 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK |
.8 mm |
75 Cel |
-20 Cel |
QUAD |
R-PQFP-G80 |
3.05 mm |
14 mm |
Not Qualified |
20 mm |
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Renesas Electronics |
MILITARY |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
CMOS |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-XDIP-T16 |
T-1(DS1) |
Not Qualified |
e0 |
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Renesas Electronics |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
30 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
5 V |
IN-LINE, SHRINK PITCH |
1.778 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDIP-T30 |
5.06 mm |
10.16 mm |
Not Qualified |
27.1 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
36 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
105 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N36 |
1 |
.8 mm |
6 mm |
e3 |
260 |
6 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
44 |
VQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-PQCC-N44 |
1 mm |
6 mm |
Not Qualified |
e0 |
6 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
MILITARY |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G16 |
1 |
1.2 mm |
4.4 mm |
Not Qualified |
e3 |
30 |
260 |
5 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
100 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.528 mA |
3.3 V |
3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
30 |
260 |
14 mm |
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Renesas Electronics |
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Renesas Electronics |
J BEND |
68 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
5 V |
5 |
CHIP CARRIER |
LDCC68,1.0SQ |
Other Telecom ICs |
1.27 mm |
Tin/Lead (Sn/Pb) |
QUAD |
S-PQCC-J68 |
Not Qualified |
e0 |
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Renesas Electronics |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
46 |
HVQCCN |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
1.2 |
CHIP CARRIER |
LCC46,.16X.28,16 |
Other Telecom ICs |
.4 mm |
70 Cel |
0 Cel |
QUAD |
R-PQCC-N46 |
.75 mm |
4 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
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Renesas Electronics |
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Renesas Electronics |
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Renesas Electronics |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
20 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
70 Cel |
-20 Cel |
DUAL |
R-PDSO-G20 |
1.1 mm |
4.4 mm |
Not Qualified |
6.7 mm |
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Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SOP16,.25 |
.65 mm |
85 Cel |
-40 Cel |
Matte Tin (Sn) - annealed |
DUAL |
80 Mbps |
R-PDSO-G16 |
1.2 mm |
4.4 mm |
e3 |
5 mm |
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Renesas Electronics |
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|
Renesas Electronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Tin (Sn) |
QUAD |
S-XQCC-N28 |
1 |
.8 mm |
5 mm |
e3 |
NOT SPECIFIED |
260 |
5 mm |
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Renesas Electronics |
INDUSTRIAL |
GULL WING |
100 |
QFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1.8,3.3 |
FLATPACK |
QFP100,.63X.87 |
Other Telecom ICs |
.635 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
T-1(DS1) |
CEPT PCM-30/E-1 |
Not Qualified |
e0 |
20 |
225 |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.