Other Function Telecom Interface ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

RN4678APL-V/RM122

Microchip Technology

TELECOM CIRCUIT

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

BMD-380-A-R

U-blox Ag

TELECOM CIRCUIT

L96-M33

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.5 mm

9.6 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

ODIN-W260-03B

U-blox Ag

TELECOM CIRCUIT

4

245

CC1125RHMR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

.9 mm

5 mm

Not Qualified

e4

30

260

5 mm

ESP32-WROVER-B

Espressif Systems (Shanghai)

TELECOM CIRCUIT

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3.45 mm

18 mm

31.4 mm

NEO-M8J-0

U-blox Ag

TELECOM CIRCUIT

PE4312C-Z

Psemi

TELECOM CIRCUIT

OTHER

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

-3.3 V

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-55 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N20

1

.9 mm

4 mm

e4

30

260

4 mm

AT86RF215-ZUR

Microchip Technology

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, VERY THIN PROFILE

LCC48,.28SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N48

.9 mm

7 mm

e3

7 mm

BGM113A256V21R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

2 mm

9.15 mm

15.73 mm

BT851

Laird Technologies

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CC2500RGPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.25 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

NOT SPECIFIED

260

4 mm

SIM900

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

68

QMA

SQUARE

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

.0856 Mbps

S-XQMA-N68

SX1281IMLTRT

Semtech

TELECOM CIRCUIT

MATTE TIN

1

e3

260

BM71BLES1FC2-0002AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

16

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

MODULE,16LEAD(UNSPEC)

1.2 mm

70 Cel

-20 Cel

Nickel/Gold (Ni/Au)

UNSPECIFIED

.0086 Mbps

R-XXMA-N16

2.16 mm

9 mm

e4

11.5 mm

ESP32-WROVER-IE

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

150 Mbps

R-XDMA-N38

3

3.45 mm

18 mm

250

31.4 mm

ISP1507-AX-JT

Insight Sip

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

62

XMA

SQUARE

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N62

3

8 mm

30

260

8 mm

RS9116W-DB00-CC1-B2B

Silicon Labs

TELECOM CIRCUIT

XB3-24Z8CM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

ZED-F9R-02B

U-blox Ag

TELECOM CIRCUIT

BC660K-GL

Quectel Wireless Solutions

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

58

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

75 Cel

-35 Cel

UNSPECIFIED

.1585 Mbps

R-XXMA-N58

2 mm

15.8 mm

17.7 mm

SI4463-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NOT SPECIFIED

NOT SPECIFIED

WL1801MODGBMOCR

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BUTT

100

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.7 V

2.9/4.8

GRID ARRAY

LGA100(UNSPEC)

Other Telecom ICs

.7 mm

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

BOTTOM

100 Mbps

R-PBGA-B100

3

2 mm

13.3 mm

Not Qualified

e4

30

260

13.4 mm

BGM113A256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

2 mm

9.15 mm

15.73 mm

MAX24287ETK+

Microchip Technology

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.32SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

1000 Mbps

S-XQCC-N68

.8 mm

8 mm

8 mm

RN4678-V/RM111

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

TS 16949

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

BT832

Fanstel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-N40

14 mm

16 mm

ENW89815A3KF

Panasonic

TELECOM CIRCUIT

50

250

PN5180A0HN/C1Y

NXP Semiconductors

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

NEO-M9V-20B

U-blox Ag

TELECOM CIRCUIT

NO LEAD

24

DMA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

12.2 mm

16 mm

AP22814BW5-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G5

1.4 mm

1.6 mm

e3

30

260

3 mm

BLUENRG-248

STMicroelectronics

TELECOM CIRCUIT

3

CYW43439KUBGT

Infineon Technologies

TELECOM CIRCUIT

1

STKNXTR

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

OPA380AIDGKTG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

CMOS

.0088 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

XB3-24Z8UM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

AX5243-1-TW30

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

30

260

4 mm

MAX-M10M-00B

U-blox Ag

GNSS Module

NEO-6M-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

NOT SPECIFIED

NOT SPECIFIED

SARA-R510S-00B

U-blox Ag

TELECOM CIRCUIT

WL1835MODGBMOCT

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BUTT

100

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.7 V

2.9/4.8

GRID ARRAY

LGA100(UNSPEC)

Other Telecom ICs

.7 mm

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

BOTTOM

100 Mbps

R-PBGA-B100

3

2 mm

13.3 mm

Not Qualified

e4

30

260

13.4 mm

XCC3235MODSF12MOBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

63

QCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER

1.27 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N63

2.45 mm

17.5 mm

20.5 mm

CC2530F256RHAT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

DC-ME4-01T-S-UPW

Digi International

SERIAL DEVICE SERVER

NO LEAD

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

100 Mbps

R-XXMA-N

18.67 mm

19.05 mm

36.7 mm

NINA-B112-03B

U-blox Ag

TELECOM CIRCUIT

4

OPA380AIDG4

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.008 mA

5 V

3/5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

2

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

RN41-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

UNSPECIFIED

R-XXMA-N32

2.2 mm

13.2 mm

e3

25.8 mm

RN4678-V/RM122

Microchip Technology

TELECOM CIRCUIT

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.