Other Function Telecom Interface ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

RS9116N-DB00-CC0-B00

Silicon Labs

TELECOM CIRCUIT

AD9832BRUZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e3

30

260

5 mm

AP22804AW5-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

5

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.95 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G5

1.4 mm

1.6 mm

e3

30

260

3 mm

STKNX

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

XWL1837MODGIMOC

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

100

LGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.7 V

GRID ARRAY

.7 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-N100

2 mm

13.3 mm

13.4 mm

BQ51013BYFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BMD-360-A-R

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

47

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N47

3

1.9 mm

9.8 mm

250

14 mm

ST60-SIPT

Laird Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

84

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-30 Cel

UNSPECIFIED

866.7 Mbps

R-XXMA-N84

1.87 mm

13 mm

NOT SPECIFIED

NOT SPECIFIED

14 mm

L80-M39

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

DUAL

S-XDMA-N12

7.05 mm

16 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

RN4678APL-V/RM120

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

CC430F6137IRGCR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

64

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

2.2 V

CHIP CARRIER, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

.25 Mbps

S-PQCC-N64

3

1 mm

9 mm

Not Qualified

e4

30

260

9 mm

NEO-M8U-0-10

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

DMA

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100; TS 16949

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

NOT SPECIFIED

NOT SPECIFIED

16 mm

BLUENRG-MSCSP

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BUTT

34

VFLGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B34

1

.5 mm

2.56 mm

2.66 mm

HTRC11001T

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

3

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

Not Qualified

e4

CYBT-343026-01

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

24

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.22 mm

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N24

3

1.95 mm

12 mm

15.5 mm

EFR32BG22C222F352GM32-C

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

2

e3

40

260

EFR32BG22C224F512GN32-C

Silicon Labs

TELECOM CIRCUIT

NICKEL PALLADIUM GOLD

2

e4

40

260

ETRX357HR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N33

19 mm

25 mm

MGC3130-I/MQ

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N28

1 mm

5 mm

e3

5 mm

SIM7600G

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

135

XMA

SQUARE

UNSPECIFIED

YES

1

3.8 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

42 Mbps

S-XXMA-N135

3149

Cts

SI4460-C2A-GMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NOT SPECIFIED

NOT SPECIFIED

BGM220SC22WGA2

Silicon Labs

TELECOM CIRCUIT

3

40

260

PN5120A0HN1/C1,151

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.3,2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

260

5 mm

BGSA14GN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-30 Cel

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

1.5 mm

MGM12P32F1024GE-V2

Silicon Labs

TELECOM CIRCUIT

NINA-B112-05B

U-blox Ag

TELECOM CIRCUIT

SIM68M

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

DMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N18

BGB707L7ESDE6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

NO LEAD

7

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q101

3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

GOLD PALLADIUM

DUAL

R-PDSO-N7

1

.5 mm

1.3 mm

2 mm

CLRC66301HN,557

NXP Semiconductors

TELECOM CIRCUIT

2

30

260

ZOE-M8Q

U-blox Ag

TELECOM CIRCUIT

2614021137000

Wurth Elektronik

TELECOM CIRCUIT

3

30

250

BQ51003YFPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

5

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

NEO-M8M-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100; TS 16949

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

16 mm

AP22800HB-7

Diodes Incorporated

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N8

.605 mm

1.6 mm

e4

260

2.1 mm

MGM240PA32VNA3

Silicon Labs

TELECOM CIRCUIT

OPA380AIDGKR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

1

.008 mA

5 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

Other Telecom ICs

.65 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

S-PDSO-G8

2

1.1 mm

3 mm

Not Qualified

e4

30

260

3 mm

RN4678APL-V/RM113

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

22 mm

SN65DSI83ZQET

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B64

1 mm

5 mm

5 mm

ST25R3917-AQWT

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

WF111-A-V1

Silicon Labs

TELECOM CIRCUIT

WT32I-A-AI6-APTX

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

3

2.55 mm

15.9 mm

40

260

23.9 mm

CC2541F256TRHATQ1

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

2 Mbps

S-PQCC-N40

3

1 mm

6 mm

e4

30

260

6 mm

EVA-M8Q-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

43

XMA

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N43

1.16 mm

7 mm

7 mm

MCP2120T-I/SL

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

.016 mA

5 V

3/5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e3

40

260

8.65 mm

NRF51822-CDAB-R

Nordic Semiconductor Asa

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

75 Cel

-25 Cel

BOTTOM

R-PBGA-B56

1

.55 mm

3.33 mm

3.5 mm

ST7580

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.03 mA

13 V

13

CHIP CARRIER

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

XB3-24Z8US-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

NOT SPECIFIED

NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.