Other Function Telecom Interface ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

NINA-B112-04B

U-blox Ag

TELECOM CIRCUIT

4

ST25RU3993-BQFT

STMicroelectronics

TELECOM CIRCUIT

BMD-300-A-R-10

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

47

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N47

1.9 mm

9.8 mm

14 mm

BM78SPPS5NC2-0002AA

Microchip Technology

TELECOM CIRCUIT

COMMERCIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

YES

1

1.9 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

70 Cel

-20 Cel

GOLD OVER NICKEL

UNSPECIFIED

R-XXMA-N33

2.46 mm

12 mm

e4

40

255

22 mm

BQ51013BYFPR

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

DWM3000TR13

Qorvo

TELECOM CIRCUIT

SX1503I091TRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N28

.6 mm

4 mm

Not Qualified

e3

4 mm

TUSB211IRWBR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

.02 mA

3.3 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

480.24 Mbps

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

MAX2771ETI+

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.85 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC28,.2SQ,20

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-XQCC-N28

1

.8 mm

5 mm

e3

30

260

5 mm

RS9116W-DB00-CC1-X23

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

107

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.85 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-N107

ZED-F9T-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

4

2.6 mm

17 mm

22 mm

HTRC11001T/02EE

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.01 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

8.65 mm

NORA-B106-00B

U-blox Ag

TELECOM CIRCUIT

WSM-BL241-ADA-008

Murata Manufacturing

TELECOM CIRCUIT

INDUSTRIAL

BUTT

LGA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

R-XBGA-B

ADRV9002BBCZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA196,14X14,32

.8 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.19 mm

12 mm

30

260

12 mm

EFR32BG22C224F512IM40-C

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

2

e3

40

260

XBP9X-DMUS-001

Digi International

TELECOM CIRCUIT

NO LEAD

37

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.25 Mbps

R-XXMA-N37

L86-M33

Quectel Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

SQUARE

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

S-XDMA-N12

7.15 mm

18.4 mm

260

18.4 mm

TRF37B73IDSGT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N8

1

.8 mm

2 mm

e4

30

260

2 mm

HMC624ALP4E

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-N24

1

1 mm

4 mm

e3

260

4 mm

ATWILC3000-MR110CA

Microchip Technology

TELECOM CIRCUIT

NO LEAD

36

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.204 mm

85 Cel

-40 Cel

UNSPECIFIED

65 Mbps

R-XXMA-X36

3

2.09 mm

22.428 mm

250

14.732 mm

BLUENRG-232N

STMicroelectronics

TELECOM CIRCUIT

FUSB340TMX

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

18

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

R-PQCC-N18

1

.45 mm

2 mm

e4

30

260

2.8 mm

NEO-M8Q-0-10

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

16 mm

NINA-B112-04B-00

U-blox Ag

TELECOM CIRCUIT

LBWA1UZ1GC-958

Murata Manufacturing

TELECOM CIRCUIT

OTHER

NO LEAD

LGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY

85 Cel

-30 Cel

BOTTOM

S-PBGA-N

SIM7020E

Simcom Wireless Solutions

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

42

QMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

QUAD

.0625 Mbps

R-XQMA-N42

SN65DSI83ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

BT832F

Fanstel

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

1 Mbps

R-XXMA-N40

14 mm

20.8 mm

CC2520RHDT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

NO LEAD

28

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N28

3

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

XB3-24Z8PT

Digi International

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

UNSPECIFIED

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

X-XDMA-T20

BMD-300-A-R-00

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

47

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N47

1.9 mm

9.8 mm

14 mm

ESP32-WROOM-32U(4MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

3

3.3 mm

18 mm

250

19.2 mm

ESP32-WROVER(8MB)

Espressif Systems (Shanghai)

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

UNSPECIFIED

150 Mbps

R-XXMA-N38

3

3.4 mm

18 mm

250

31.4 mm

453-00059R

Laird Technologies

TELECOM CIRCUIT

30

260

AD9363ABCZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

30

260

10 mm

EFR32BG22C224F512GM40-C

Silicon Labs

TELECOM CIRCUIT

MATTE TIN

2

e3

40

260

75S10010A200BR

Renesas Electronics

NEO-M8N

U-blox Ag

TELECOM CIRCUIT

NEO-6M-0-001

U-blox Ag

TELECOM CIRCUIT

SPIRIT1QTR

STMicroelectronics

RF AND BASEBAND CIRCUIT

MATTE TIN

3

e3

40

260

BLUENRG-132

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N32

1 mm

5 mm

NOT SPECIFIED

NOT SPECIFIED

5 mm

NEO-M8U-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100; TS 16949

3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-N24

4

2.6 mm

12.2 mm

16 mm

NINA-B306-00B

U-blox Ag

TELECOM CIRCUIT

ODIN-W260-04B

U-blox Ag

4

A1101R08A00GM

Ttm Technologies

TELECOM CIRCUIT

BGM111A256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.2 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.1 mm

12.9 mm

15 mm

TESEO-LIV3R

STMicroelectronics

TELECOM CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.