TELEPHONE DIALER CIRCUIT Telephone Line ICs 133

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	Additional Features	Crystal Frequency (MHz)	JESD-609 Code	Make-break Ratio	Length
PCD3344T/047	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e4	3:2	17.9 mm
PCD3315TD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	17.9 mm
PCD3322CT	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.4 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	12.8 mm
PCD3344P/004	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28	5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4	3:2	35.5 mm
PCD3322CT-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.4 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	12.8 mm
PCD3347P/001	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T20	4.2 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4	3:2	26.73 mm
PCD3344P/011	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28	5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4	3:2	35.5 mm
PCD3321CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	21.6 mm
PCD3310TD	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.2 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified				1:2	17.9 mm
PCD3310GP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20	4.2 mm	7.62 mm	Not Qualified				1:2	26.73 mm
PCD3325CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	21.6 mm
PCD3327CT-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.4 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	12.8 mm
PCD3310AT-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.9 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified				1:1.5	17.9 mm
PCD3310TD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.2 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified			e4	1:2	17.9 mm
PCD3347T/001	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e4	3:2	12.8 mm
PCD3315TD	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	17.9 mm
PCD4415TD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.9 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified			e4	1:2	12.8 mm
PCD3311PN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		1.2 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T14	4.7 mm	7.62 mm	Not Qualified
PCD3327CU	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1					UNCASED CHIP				70 Cel	-25 Cel		UPPER	R-XUUC-N18			Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1			3:2
PCD3310FT	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.2 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified				1:2	17.9 mm
PCD3324CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	21.6 mm
PCD4415PN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified			e3/e4	1:2
PCD3315T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1			3:2	17.9 mm
PCD4415APN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.9 mA	5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified			e3/e4	1:1.5
PCD3310HP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20	4.2 mm	7.62 mm	Not Qualified				1:2	26.73 mm
PCD3310T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.9 mA	5 V	3/5	SMALL OUTLINE	SOP28,.4	Telephone Circuits	1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified		3.58		1:1.5	17.9 mm
PCD3344T/004	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e4	3:2	17.9 mm
PCD3322CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	21.6 mm
PCD3310CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20	4.2 mm	7.62 mm	Not Qualified				1:2	26.73 mm
PCD3321CT-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.4 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	12.8 mm
PCD3320CD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-GDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5
PCD4415ATD	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.9 mA	5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	2.65 mm	7.5 mm	Not Qualified			e4	1:1.5	12.8 mm
PCD3326CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	21.6 mm
PCD3327CP	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T18	4.7 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5	21.6 mm
PCD3349P/018	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			5 V		IN-LINE			2.54 mm	70 Cel	-25 Cel	TIN/NICKEL PALLADIUM GOLD	DUAL	R-PDIP-T28	5.1 mm	15.24 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 2:1		e3/e4	3:2	35.5 mm
PCD3310APN	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1		.2 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20	4.2 mm	7.62 mm	Not Qualified				1:1.5	26.73 mm
PCD3321CD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1		.4 mA	3 V		IN-LINE			2.54 mm	70 Cel	-25 Cel		DUAL	R-GDIP-T18	5.08 mm	7.62 mm	Not Qualified	SELECTABLE MAKE/BREAK RATIO 1:2			1:1.5
PCD3310GT	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.2 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified				1:2	17.9 mm
PCD3310ATD-T	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.2 mA	3 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G28	2.65 mm	7.5 mm	Not Qualified				1:1.5	17.9 mm
PCD3310P	NXP Semiconductors	TELEPHONE DIALER CIRCUIT	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS	.9 mA	5 V	3/5	IN-LINE	DIP20,.3	Telephone Circuits	2.54 mm	70 Cel	-25 Cel		DUAL	R-PDIP-T20	4.2 mm	7.62 mm	Not Qualified		3.58		1:2	26.73 mm
TC31020P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T24	4.45 mm	7.62 mm	Not Qualified			e0		29.8 mm
TC35205P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T24	4.45 mm	7.62 mm	Not Qualified			e0		29.8 mm
TC35219F	Toshiba	TELEPHONE DIALER CIRCUIT		GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					SMALL OUTLINE						TIN LEAD	DUAL	R-PDSO-G14			Not Qualified			e0
TC35219P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T14	4.45 mm	7.62 mm	Not Qualified			e0		19.25 mm
TC31021P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T24	4.45 mm	7.62 mm	Not Qualified			e0		29.8 mm
TC35206P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T24	4.45 mm	7.62 mm	Not Qualified			e0		29.8 mm
TC35207P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T24	4.45 mm	7.62 mm	Not Qualified			e0		29.8 mm
TC35204P	Toshiba	TELEPHONE DIALER CIRCUIT		THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1					IN-LINE			2.54 mm			TIN LEAD	DUAL	R-PDIP-T24	4.45 mm	7.62 mm	Not Qualified			e0		29.8 mm

Telephone Line ICs

Telephone Line ICs are electronic components used in telephone systems to interface with the telephone line and provide necessary functionality for telephone communication. These ICs are designed to provide reliable and efficient operation of the telephone line, allowing for clear and uninterrupted communication between two devices.

Telephone Line ICs use various techniques to interface with the telephone line, including pulse dialing, dual-tone multi-frequency (DTMF) signaling, and loop current sensing. Pulse dialing is used to send a series of electrical pulses over the telephone line to dial a phone number. DTMF signaling is used to send a sequence of tones to control various telephone functions, such as call forwarding and call waiting. Loop current sensing is used to detect the presence of a telephone off-hook condition, allowing the telephone system to provide appropriate signaling and call management.

Some common features of Telephone Line ICs include:

1. Telephone line interface: Telephone Line ICs provide the necessary interface with the telephone line to enable telephone communication.

2. Signal processing: Telephone Line ICs are designed to process signals quickly and efficiently, ensuring clear and uninterrupted communication.

3. Tone generation and detection: Telephone Line ICs can generate and detect various tones used for telephone communication, such as dial tones and busy signals.

4. Call management: Telephone Line ICs can provide call management functions, such as call waiting and call forwarding.

Telephone Line ICs are used in a variety of telephone systems, including traditional landline phones, cordless phones, and PBX (Private Branch Exchange) systems. They are also used in other communication systems that require telephone line interface, such as alarm systems and security systems.