NXP Semiconductors - PCD3325CP

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PCD3325CP by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PCD3325CP
Description TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet PCD3325CP Datasheet
In Stock2,445
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Telecom IC Type: TELEPHONE DIALER CIRCUIT
Maximum Seated Height: 4.7 mm
Surface Mount: NO
Maximum Supply Current: .4 mA
Minimum Operating Temperature: -25 Cel
Make-break Ratio: 1:1.5
No. of Functions: 1
No. of Terminals: 18
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 21.6 mm
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Additional Features: SELECTABLE MAKE/BREAK RATIO 1:2
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Width: 7.62 mm
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
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