NXP Semiconductors - PCD3331-1P

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PCD3331-1P by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number PCD3331-1P
Description TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet PCD3331-1P Datasheet
In Stock1,876
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: TELEPHONE MULTIFUNCTION CIRCUIT
Maximum Seated Height: 4.2 mm
Surface Mount: NO
Minimum Operating Temperature: -25 Cel
Make-break Ratio: 3:2
No. of Functions: 1
No. of Terminals: 20
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 26.73 mm
JESD-30 Code: R-PDIP-T20
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Additional Features: SELECTABLE MAKE/BREAK RATIO 2:1
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Width: 7.62 mm
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
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