100 A Power Bipolar Junction Transistors (BJT) 29

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) Maximum Drain Current (Abs) (ID) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Gate-Emitter Voltage Maximum Turn Off Time (toff) Maximum Gate-Emitter Threshold Voltage Terminal Finish Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Reference Standard

BUT30V

STMicroelectronics

NPN

SINGLE

NO

250 W

100 A

UNSPECIFIED

SWITCHING

.9 V

UNSPECIFIED

RECTANGULAR

1

200 ns

3

FLANGE MOUNT

BIP General Purpose Power

250 W

150 Cel

SILICON

125 V

2200 ns

NICKEL

UPPER

R-XUFM-X3

ISOLATED

Not Qualified

ESM3030DV

STMicroelectronics

NPN

DARLINGTON WITH BUILT-IN DIODE

NO

225 W

100 A

UNSPECIFIED

SWITCHING

2.2 V

UNSPECIFIED

RECTANGULAR

1

600 ns

4

FLANGE MOUNT

BIP General Purpose Power

225 W

150 Cel

SILICON

300 V

NICKEL

UPPER

R-XUFM-X4

ISOLATED

Not Qualified

TIXP549

Texas Instruments

NPN

SINGLE

NO

3 MHz

8.5 W

100 A

METAL

SWITCHING

SOLDER LUG

ROUND

1

3

POST/STUD MOUNT

Other Transistors

5

175 Cel

SILICON

100 V

UPPER

O-MUPM-D3

COLLECTOR

Not Qualified

TO-114

TIXP548

Texas Instruments

NPN

SINGLE

NO

3 MHz

8.5 W

100 A

METAL

SWITCHING

SOLDER LUG

ROUND

1

3

POST/STUD MOUNT

Other Transistors

5

175 Cel

SILICON

80 V

UPPER

O-MUPM-D3

COLLECTOR

Not Qualified

TO-114

TIXP547

Texas Instruments

NPN

SINGLE

NO

3 MHz

100 A

METAL

SWITCHING

SOLDER LUG

ROUND

1

3

POST/STUD MOUNT

5

SILICON

60 V

UPPER

O-MUPM-D3

COLLECTOR

Not Qualified

TO-114

STF8045DF

STMicroelectronics

270 W

100 A

2 V

1

500 ns

BIP General Purpose Power

150 Cel

STF8045AV

STMicroelectronics

270 W

100 A

2 V

1

600 ns

BIP General Purpose Power

150 Cel

STF8045DV

STMicroelectronics

270 W

100 A

2 V

1

500 ns

BIP General Purpose Power

150 Cel

STF8045AF

STMicroelectronics

270 W

100 A

2 V

1

600 ns

BIP General Purpose Power

150 Cel

SGS100DA020D

STMicroelectronics

375 W

100 A

2 V

1

600 ns

BIP General Purpose Power

100

150 Cel

BUT30F

STMicroelectronics

250 W

100 A

1.5 V

1

200 ns

BIP General Purpose Power

150 Cel

ESM3030DF

STMicroelectronics

225 W

100 A

2.2 V

1

600 ns

BIP General Purpose Power

150 Cel

2SD647A

Toshiba

NPN

SINGLE

YES

100 A

CERAMIC, METAL-SEALED COFIRED

SWITCHING

NO LEAD

ROUND

1

2

DISK BUTTON

100

SILICON

600 V

END

O-CEDB-N2

Not Qualified

MG100G2DL1

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG100G2CL1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

5

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X5

ISOLATED

Not Qualified

MG100Q2YK1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

9

FLANGE MOUNT

100

SILICON

900 V

UPPER

R-PUFM-X9

ISOLATED

Not Qualified

MG100H2CK1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

5

FLANGE MOUNT

200

SILICON

550 V

UPPER

R-PUFM-X5

ISOLATED

Not Qualified

MG100G2CH1

Toshiba

400 W

100 A

3.5 V

1

1500 ns

BIP General Purpose Power

150 Cel

MG100H2CL1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

5

FLANGE MOUNT

80

SILICON

550 V

UPPER

R-PUFM-X5

ISOLATED

Not Qualified

MG100M2CK1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

7

FLANGE MOUNT

100

SILICON

880 V

UPPER

R-PUFM-X7

ISOLATED

Not Qualified

MG100G2YL1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

7

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X7

ISOLATED

Not Qualified

ST100Q22

Toshiba

NPN

SINGLE

YES

100 A

CERAMIC, METAL-SEALED COFIRED

SWITCHING

NO LEAD

ROUND

1

2

DISK BUTTON

80

SILICON

END

O-CEDB-N2

Not Qualified

MG100H2DL2

Toshiba

NPN

2 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

6

FLANGE MOUNT

80

SILICON

550 V

UPPER

R-PUFM-X6

ISOLATED

Not Qualified

MG100G1AL3

Toshiba

NPN

DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

1

3

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X3

ISOLATED

Not Qualified

MG100H2YL1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

7

FLANGE MOUNT

80

SILICON

550 V

UPPER

R-PUFM-X7

ISOLATED

Not Qualified

MG100G1FL1

Toshiba

NPN

DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

1

4

FLANGE MOUNT

100

SILICON

450 V

UPPER

R-PUFM-X4

ISOLATED

Not Qualified

MG100G1JL1

Toshiba

NPN

DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

100 A

1

SILICON

450 V

Not Qualified

MG100M2YK1

Toshiba

NPN

COMPLEX

NO

100 A

PLASTIC/EPOXY

SWITCHING

UNSPECIFIED

RECTANGULAR

2

9

FLANGE MOUNT

100

SILICON

880 V

UPPER

R-PUFM-X9

ISOLATED

Not Qualified

2SD1165A

Toshiba

NPN

SINGLE

YES

100 A

CERAMIC, METAL-SEALED COFIRED

SWITCHING

NO LEAD

ROUND

1

2

DISK BUTTON

60

SILICON

900 V

END

O-CEDB-N2

Not Qualified

Power Bipolar Junction Transistors (BJT)

Power Bipolar Junction Transistors (BJT) are electronic devices used in power electronics to control and switch high current and voltage levels. They are commonly used in applications such as power supplies, motor drives, and welding equipment.

The Power BJT is a three-layer device that consists of an emitter, base, and collector region. The emitter and collector are heavily doped, while the base region is lightly doped. The power BJT works by controlling the flow of majority charge carriers (electrons or holes) from the emitter to the collector region through the base region. When a voltage is applied to the base-emitter junction, a current flows through the base, allowing a larger current to flow from the emitter to the collector.

Power BJTs are designed to handle high current and voltage levels, and have a low on-resistance and high gain. They are typically used in applications that require efficient and precise control of power, such as motor drives and power supplies.

Power BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as UL (Underwriters Laboratories) and CE (Conformité Européenne), to ensure their safety and performance.

Proper selection and use of Power BJTs are critical to ensure safe and reliable operation of power electronics systems. Power BJTs are often used in conjunction with other components, such as diodes and capacitors, to form complete power electronics circuits.