Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Maximum Power Dissipation (Abs) | Package Body Material | Transistor Application | Minimum DS Breakdown Voltage | Minimum Power Gain (Gp) | Terminal Form | Package Shape | Operating Mode | No. of Elements | Highest Frequency Band | Maximum Pulsed Drain Current (IDM) | Maximum Drain Current (Abs) (ID) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Maximum Operating Temperature | Transistor Element Material | Minimum Operating Temperature | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
DUAL |
R-CDFM-F2 |
SOURCE |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
|
NXP Semiconductors |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
60 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
2.1 A |
DUAL |
R-CDFM-F2 |
NOT APPLICABLE |
SOURCE |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
|
NXP Semiconductors |
40 |
260 |
|||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
16.5 A |
DUAL |
R-CDFP-F2 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
100 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
2.5 A |
DUAL |
R-CDFM-F2 |
SOURCE |
|||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
PLASTIC/EPOXY |
AMPLIFIER |
15 V |
NO LEAD |
RECTANGULAR |
DEPLETION MODE |
1 |
S BAND |
4 |
SMALL OUTLINE |
Other Transistors |
HIGH ELECTRON MOBILITY |
22.7 W |
85 Cel |
GALLIUM ARSENIDE |
Matte Tin (Sn) |
QUAD |
R-PQSO-N4 |
1 |
SOURCE |
Not Qualified |
e3 |
40 |
260 |
||||||||||||
|
NXP Semiconductors |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
TIN |
3 |
e3 |
40 |
260 |
||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
165 W |
PLASTIC/EPOXY |
AMPLIFIER |
40 V |
C BEND |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
VERY HIGH FREQUENCY BAND |
12 A |
6 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
Matte Tin (Sn) |
12 A |
DUAL |
R-PDFM-C6 |
3 |
SOURCE |
Not Qualified |
TO-272AA |
e3 |
40 |
260 |
|||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
28 A |
DUAL |
R-CDFM-F2 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 3 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
3 |
L BAND |
8 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
64 A |
DUAL |
R-CDFM-F8 |
SOURCE |
|||||||||||||||||||||
|
NXP Semiconductors |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
1.5 A |
DUAL |
R-CDFM-F6 |
ISOLATED |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLATPACK |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-CDFP-F2 |
SOURCE |
Not Qualified |
40 |
260 |
|||||||||||||||||
|
NXP Semiconductors |
40 |
260 |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
60 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
2.1 A |
DUAL |
R-CDFM-F2 |
SOURCE |
|||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
12 A |
2 |
FLATPACK |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
12 A |
DUAL |
R-CDFP-F2 |
SOURCE |
Not Qualified |
||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
9 A |
DUAL |
R-CDFM-F4 |
SOURCE |
Not Qualified |
HIGH RELIABILITY |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||
|
NXP Semiconductors |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
18 A |
DUAL |
R-CDFM-F2 |
SOURCE |
|||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
UNSPECIFIED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
FET General Purpose Powers |
METAL-OXIDE SEMICONDUCTOR |
225 Cel |
SILICON |
DUAL |
R-XDFM-F2 |
SOURCE |
Not Qualified |
40 |
260 |
||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
28 A |
DUAL |
R-CDFM-F2 |
NOT APPLICABLE |
SOURCE |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
6 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
3.5 A |
DUAL |
R-CDFM-F6 |
ISOLATED |
Not Qualified |
HIGH RELIABILITY |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
28 A |
DUAL |
R-CDFM-F2 |
SOURCE |
|||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
20 W |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
GULL WING |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
SMALL OUTLINE |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
DUAL |
R-CDSO-G2 |
SOURCE |
Not Qualified |
40 |
260 |
|||||||||||||||
|
NXP Semiconductors |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
PLASTIC/EPOXY |
AMPLIFIER |
15 V |
NO LEAD |
RECTANGULAR |
DEPLETION MODE |
1 |
C BAND |
4 |
SMALL OUTLINE |
FET RF Small Signal |
HIGH ELECTRON MOBILITY |
175 Cel |
GALLIUM ARSENIDE |
Matte Tin (Sn) |
QUAD |
R-PQSO-N4 |
3 |
SOURCE |
Not Qualified |
e3 |
40 |
260 |
|||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
18 A |
DUAL |
R-CDFP-F2 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
75 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
3 |
FLATPACK |
FET General Purpose Powers |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
DUAL |
R-CDFP-F3 |
SOURCE |
Not Qualified |
|||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
ULTRA HIGH FREQUENCY BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
200 Cel |
SILICON |
9 A |
DUAL |
R-CDFM-F2 |
SOURCE |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
165 W |
PLASTIC/EPOXY |
AMPLIFIER |
40 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
VERY HIGH FREQUENCY BAND |
12 A |
6 |
FLANGE MOUNT |
FET General Purpose Power |
METAL-OXIDE SEMICONDUCTOR |
150 Cel |
SILICON |
Tin/Lead (Sn/Pb) |
12 A |
DUAL |
R-PDFM-F6 |
1 |
Not Qualified |
TO-272 |
e0 |
40 |
260 |
|||||||||||
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
ULTRA HIGH FREQUENCY BAND |
4 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
64 A |
DUAL |
R-CDFP-F4 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
36 A |
DUAL |
R-CDFM-F2 |
NOT APPLICABLE |
SOURCE |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
L BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
DUAL |
R-CDFP-F2 |
SOURCE |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
COMMON SOURCE, 2 ELEMENTS |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
2 |
S BAND |
4 |
FLANGE MOUNT |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
18 A |
DUAL |
R-CDFM-F4 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
NOT APPLICABLE |
NOT SPECIFIED |
NOT SPECIFIED |
||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
18 A |
DUAL |
R-CDFP-F2 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
||||||||||||||||||||||||||||||||||||||||
NXP Semiconductors |
N-CHANNEL |
SINGLE |
YES |
CERAMIC, METAL-SEALED COFIRED |
AMPLIFIER |
65 V |
FLAT |
RECTANGULAR |
ENHANCEMENT MODE |
1 |
S BAND |
2 |
FLATPACK |
METAL-OXIDE SEMICONDUCTOR |
SILICON |
34 A |
DUAL |
R-CDFP-F2 |
SOURCE |
|||||||||||||||||||||
NXP Semiconductors |
RF Power Field Effect Transistors (FET) are electronic devices used in high-frequency RF (radio frequency) applications to amplify and control high-power signals. They are commonly used in applications such as broadcasting, radar, and satellite communications.
RF Power FETs are designed to handle high-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a low on-resistance and high gain, making them suitable for high-power amplification.
The RF Power FET consists of a gate, source, and drain electrode, and works by controlling the flow of majority charge carriers (electrons or holes) between the source and drain regions through the gate electrode. When a voltage is applied to the gate electrode, it creates an electric field that modifies the conductivity of the channel, allowing current to flow between the source and drain.
RF Power FETs are available in various types and configurations, including N-channel and P-channel FETs, and can handle power levels ranging from a few watts to several kilowatts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.