SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR Small Signal Bipolar Junction Transistors (BJT) 2,394

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Minimum DS Breakdown Voltage Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Turn Off Time (toff) Terminal Finish Maximum Drain-Source On Resistance Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Feedback Capacitance (Crss) Reference Standard

BCR35PN-E6433

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

150 MHz

.25 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

70

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

260

BCR35PNH6433XTMA1

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

150 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

DUAL

R-PDSO-G6

BUILT-IN BIAS RESISTOR RATIO IS 4.7

NOT SPECIFIED

NOT SPECIFIED

AEC-Q101

DDC114EU-7-F

Diodes Incorporated

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.2 W

.1 A

PLASTIC/EPOXY

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

IMD10AT108

ROHM

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signals

100

150 Cel

SILICON

50 V

TIN SILVER COPPER

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e1

10

260

NSVMUN5214DW1T3G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.385 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 4.7

e3

30

260

AEC-Q101

PEMD16,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 2.1

e3

30

260

PEMH24,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.02 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PIMD2,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.6 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

60

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMD24,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.02 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PUMD48,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMH9-QZ

Nexperia

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

100

150 Cel

2.5 pF

SILICON

50 V

-55 Cel

DUAL

R-PDSO-G6

BUILT-IN BIAS RESISTOR RATIO IS 4.7

AEC-Q101; IEC-60134

BCR183SH6433XTMA1

Infineon Technologies

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

200 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101

NSBC113EDXV6T1

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.5 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

3

SILICON

50 V

TIN

DUAL

R-PDSO-F6

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

260

NSBC113EDXV6T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.5 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

3

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

NSBC113EPDXV6T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.5 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

3

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMD16

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 2.1

e3

30

260

PUMD2-QX

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.15 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

60

150 Cel

2.5 pF

SILICON

50 V

-55 Cel

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101; IEC-60134

PUMD9,135

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

30

260

PUMD9,165

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

30

260

PUMH10

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 21

e3

30

260

PUMH9-QH

Nexperia

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

100

150 Cel

2.5 pF

SILICON

50 V

-55 Cel

DUAL

R-PDSO-G6

BUILT-IN BIAS RESISTOR RATIO IS 4.7

AEC-Q101; IEC-60134

BCR08PNH6727XTSA1

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

100 MHz

.07 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

DUAL

R-PDSO-G6

BUILT-IN BIAS RESISTOR RATIO 1

NOT SPECIFIED

NOT SPECIFIED

BCR108SH6433XTMA1

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

170 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

DUAL

R-PDSO-G6

BUILT-IN BIAS RESISTOR RATIO IS 21.36

NOT SPECIFIED

NOT SPECIFIED

AEC-Q101

BCR22PNH6433XTMA1

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

130 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

50

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTANCE RATIO IS 1

NOT SPECIFIED

NOT SPECIFIED

AEC-Q101

BCR35PN

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

150 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

70

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 0.21

e3

NOT SPECIFIED

NOT SPECIFIED

DCX114EU-7-F

Diodes Incorporated

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.2 W

.1 A

PLASTIC/EPOXY

.3 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signals

100

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

MIL-STD-202

DCX143EU-7-F

Diodes Incorporated

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.2 W

.1 A

PLASTIC/EPOXY

.3 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signals

100

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

MIL-STD-202

EMH25FHAT2R

ROHM

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

80

SILICON

50 V

DUAL

R-PDSO-F6

BUILT IN BIAS RESISTANCE RATIO IS 10

NOT SPECIFIED

NOT SPECIFIED

AEC-Q101

EMH60T2R

ROHM

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

80

SILICON

50 V

DUAL

R-PDSO-F6

1

BUILT IN BIAS RESISTANCE RATIO IS 21

10

260

MUN5312DW1T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.15 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

60

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

PEMH13

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

PUMB20,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMD3

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMD9-QF

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

100

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTANCE RATIO IS 4.7

AEC-Q101; IEC-60134

PUMH11F

Nexperia

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.15 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

SMUN5111DW1T1G

Onsemi

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.385 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

35

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

e3

30

260

AEC-Q101

BCR22PN

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

130 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

50

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

NOT SPECIFIED

NOT SPECIFIED

AEC-Q101

MUN5213DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.385 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

NSBC114EDXV6T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.5 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

35

150 Cel

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMD9-QX

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

100

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 4.7

30

260

AEC-Q101; IEC-60134

PUMD9-QZ

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

100

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTANCE RATIO IS 4.7

AEC-Q101; IEC-60134

PUMH13

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

PUMH13F

Nexperia

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

100

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

PUMH20

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

BCR08PN

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

170 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

70

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 0.047

e3

NOT SPECIFIED

NOT SPECIFIED

PEMB1,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

60

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

UMH6NTR

ROHM

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

250 MHz

.15 W

.03 A

PLASTIC/EPOXY

SWITCHING

.3 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signals

68

150 Cel

SILICON

50 V

TIN COPPER

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 1.2

e2

10

260

PEMB11,115

NXP Semiconductors

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

Small Signal Bipolar Junction Transistors (BJT)

Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.

Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.

The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.

Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395