Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum Rise Time (tr) | Maximum VCEsat | Minimum DS Breakdown Voltage | Terminal Form | Package Shape | Operating Mode | No. of Elements | Maximum Fall Time (tf) | No. of Terminals | Package Style (Meter) | Sub-Category | Field Effect Transistor Technology | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Maximum Drain-Source On Resistance | Maximum Drain Current (ID) | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Feedback Capacitance (Crss) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.42 W |
.5 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
70 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
e3 |
30 |
260 |
||||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
170 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO IS 21.36 |
e3 |
AEC-Q101 |
|||||||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.385 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
150 Cel |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
170 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTANCE RATIO IS 21.364 |
e3 |
260 |
||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
.4 W |
60 |
150 Cel |
3.5 pF |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
||||||||||||||||
|
Onsemi |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101 |
|||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
170 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTANCE RATIO IS 21.364 |
e3 |
260 |
||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO 21.36 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
60 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101 |
|||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
60 |
150 Cel |
SILICON |
50 V |
Tin (Sn) |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.385 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.25 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 21.36 |
e3 |
30 |
260 |
AEC-Q101 |
|||||||||||||||||
|
Onsemi |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.15 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
35 |
150 Cel |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 4.7 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
Onsemi |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 21.36 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
150 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 10 |
e3 |
||||||||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
AEC-Q101; IEC-60134 |
||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Infineon Technologies |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
100 MHz |
.07 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO 1 |
e3 |
||||||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
Toshiba |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
200 MHz |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.3 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
.2 W |
70 |
150 Cel |
6 pF |
SILICON |
50 V |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
|||||||||||||||||||||||
|
Onsemi |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.385 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.25 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
150 Cel |
SILICON |
50 V |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 21.36 |
e3 |
30 |
260 |
|||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
60 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO 21.36 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Onsemi |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 10 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
130 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
AEC-Q101 |
|||||||||||||||||||||||
|
Infineon Technologies |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
130 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
50 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 1 |
e3 |
AEC-Q101 |
|||||||||||||||||||||||
|
Infineon Technologies |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
150 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
70 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT-IN BIAS RESISTOR RATIO IS 4.7 |
e3 |
AEC-Q101 |
|||||||||||||||||||||||
|
Infineon Technologies |
PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
200 MHz |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
e3 |
AEC-Q101 |
|||||||||||||||||||||||
|
Onsemi |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.256 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
80 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
BUILT IN BIAS RESISTANCE RATIO IS 4.7 |
e3 |
30 |
260 |
AEC-Q101 |
||||||||||||||||||||
|
Infineon Technologies |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
130 MHz |
.25 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
SILICON |
50 V |
MATTE TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
260 |
||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT IN BIAS RESISTOR RATIO 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Nexperia |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.15 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
80 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 4.7 |
e3 |
30 |
260 |
||||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 10 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
NXP Semiconductors |
NPN |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.2 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
100 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 4.7 |
e3 |
30 |
260 |
|||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
FLAT |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-F6 |
1 |
Not Qualified |
BUILT-IN BIAS RESISTOR RATIO IS 1 |
e3 |
30 |
260 |
|||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
Nexperia |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
230 MHz |
.3 W |
.1 A |
PLASTIC/EPOXY |
SWITCHING |
.1 V |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
30 |
150 Cel |
2.5 pF |
SILICON |
50 V |
-65 Cel |
DUAL |
R-PDSO-G6 |
BUILT IN BIAS RESISTOR RATIO IS 1 |
AEC-Q101; IEC-60134 |
|||||||||||||||||||||
|
NXP Semiconductors |
NPN AND PNP |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR |
YES |
.3 W |
PLASTIC/EPOXY |
SWITCHING |
GULL WING |
RECTANGULAR |
2 |
6 |
SMALL OUTLINE |
BIP General Purpose Small Signal |
30 |
150 Cel |
SILICON |
50 V |
TIN |
DUAL |
R-PDSO-G6 |
1 |
Not Qualified |
e3 |
30 |
260 |
Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.
Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395