SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR Small Signal Bipolar Junction Transistors (BJT) 2,394

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Part RoHS Manufacturer Polarity or Channel Type Configuration Surface Mount Nominal Transition Frequency (fT) Maximum Power Dissipation (Abs) Maximum Collector Current (IC) Package Body Material Transistor Application Maximum Rise Time (tr) Maximum VCEsat Minimum DS Breakdown Voltage Terminal Form Package Shape Operating Mode No. of Elements Maximum Fall Time (tf) No. of Terminals Package Style (Meter) Sub-Category Field Effect Transistor Technology Maximum Power Dissipation Ambient Minimum DC Current Gain (hFE) Maximum Operating Temperature Maximum Collector-Base Capacitance Transistor Element Material Maximum Collector-Emitter Voltage Maximum Turn On Time (ton) Minimum Operating Temperature Maximum Turn Off Time (toff) Terminal Finish Maximum Drain-Source On Resistance Maximum Drain Current (ID) Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Case Connection Qualification Additional Features JEDEC-95 Code JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Feedback Capacitance (Crss) Reference Standard

PIMN31,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.42 W

.5 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

70

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

e3

30

260

SMUN5311DW1T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

35

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101

BCR108SH6327XTSA1

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

170 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO IS 21.36

e3

AEC-Q101

MUN5311DW1T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.385 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

35

150 Cel

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO 1

e3

30

260

BCR108S-E6327

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

170 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 21.364

e3

260

PUMH1,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

.3 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

.4 W

60

150 Cel

3.5 pF

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

SMUN5211DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

35

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

AEC-Q101

PUMH11,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

AEC-Q101

BCR108S-E6433

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

170 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTANCE RATIO IS 21.364

e3

260

PEMH10,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 21.36

e3

30

260

PUMD3,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMD2,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

60

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PEMH11,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

AEC-Q101

SMUN5313DW1T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

30

260

AEC-Q101

PEMH13,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

PUMD2,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

60

150 Cel

SILICON

50 V

Tin (Sn)

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

SMUN5235DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.385 W

.1 A

PLASTIC/EPOXY

SWITCHING

.25 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 21.36

e3

30

260

AEC-Q101

MUN5211DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.15 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

35

150 Cel

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMH2,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO 1

e3

30

260

SMUN5314DW1T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO 4.7

e3

30

260

AEC-Q101

SMUN5335DW1T1G

Onsemi

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO 21.36

e3

30

260

AEC-Q101

BCR116SH6327XTSA1

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

150 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO 10

e3

PUMD3-QX

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTOR RATIO IS 1

e3

30

260

AEC-Q101; IEC-60134

PUMD12,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

BCR08PNH6327XTSA1

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

100 MHz

.07 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO 1

e3

PUMH13,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

RN2903,LF(CT

Toshiba

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

200 MHz

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

.3 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

.2 W

70

150 Cel

6 pF

SILICON

50 V

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTANCE RATIO IS 1

MUN5235DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.385 W

.1 A

PLASTIC/EPOXY

SWITCHING

.25 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

150 Cel

SILICON

50 V

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 21.36

e3

30

260

PEMH1,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

60

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMH10,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 21.36

e3

30

260

SMUN5233DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 10

e3

30

260

AEC-Q101

BCR133SH6327XTSA1

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

130 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

AEC-Q101

BCR22PNH6327XTSA1

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

130 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

50

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 1

e3

AEC-Q101

BCR35PNH6327XTSA1

Infineon Technologies

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

150 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

70

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

AEC-Q101

BCR183SH6327XTSA1

Infineon Technologies

PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

200 MHz

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTOR RATIO IS 1

e3

AEC-Q101

SMUN5214DW1T1G

Onsemi

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.256 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

80

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

BUILT IN BIAS RESISTANCE RATIO IS 4.7

e3

30

260

AEC-Q101

BCR133S-E6327

Infineon Technologies

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

130 MHz

.25 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

SILICON

50 V

MATTE TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

260

PUMH20,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT IN BIAS RESISTOR RATIO 1

e3

30

260

PUMH2-QX

Nexperia

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.15 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

80

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

BUILT-IN BIAS RESISTOR RATIO IS 1

AEC-Q101; IEC-60134

PUMD9,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

30

260

PUMD3,165

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMD13,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 10

e3

30

260

PUMD3-QF

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101; IEC-60134

PUMH9,115

NXP Semiconductors

NPN

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.2 W

.1 A

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

100

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 4.7

e3

30

260

PEMD3,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

FLAT

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-F6

1

Not Qualified

BUILT-IN BIAS RESISTOR RATIO IS 1

e3

30

260

PUMD3-QH

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101; IEC-60134

PUMD3-QZ

Nexperia

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

230 MHz

.3 W

.1 A

PLASTIC/EPOXY

SWITCHING

.1 V

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

30

150 Cel

2.5 pF

SILICON

50 V

-65 Cel

DUAL

R-PDSO-G6

BUILT IN BIAS RESISTOR RATIO IS 1

AEC-Q101; IEC-60134

PUMD30,115

NXP Semiconductors

NPN AND PNP

SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

YES

.3 W

PLASTIC/EPOXY

SWITCHING

GULL WING

RECTANGULAR

2

6

SMALL OUTLINE

BIP General Purpose Small Signal

30

150 Cel

SILICON

50 V

TIN

DUAL

R-PDSO-G6

1

Not Qualified

e3

30

260

Small Signal Bipolar Junction Transistors (BJT)

Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power applications to amplify and switch small signals. They are commonly used in applications such as audio amplifiers, signal processing, and low-power digital circuits.

Small Signal BJTs are designed to handle low-power levels and operate at low to medium frequencies, typically in the range of a few Hz to several MHz. They have a high gain and low noise figure, making them suitable for small signal amplification.

The Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.

Proper use of Small Signal BJTs is important to ensure optimal performance, reliability, and compatibility with other components in the circuit. Small Signal BJTs are often used in conjunction with other components, such as capacitors and resistors, to form complete low-power electronic circuits.B395