228-1290-09-0602J by 3m Electronic Products Division | Chip Carrier IC & Component Sockets

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Manufacturer	3m Electronic Products Division
Manufacturer's Part Number	228-1290-09-0602J
Description	IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYSULFONE; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Contact Material: BERYLLIUM COPPER;
Datasheet	228-1290-09-0602J Datasheet

NAME	DESCRIPTION
Contact Finish (Mating):	Gold (30) over Nickel (50)
IC Socket Type:	IC Socket
Contact Finish (Termination):	Gold (30) over Nickel (50)
Housing Material:	Glass-Filled Polysulfone (PSU)
Device Type Used On:	DIP28
Contact Material:	Beryllium Copper
Additional Features:	Standard: UL 94V-0
JESD-609 Code:	e4
No. of Contacts:	28

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