Image shown is a representation only.
| Manufacturer | Broadcom |
|---|---|
| Manufacturer's Part Number | BCM5633 |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 785; Package Code: BGA; Package Shape: UNSPECIFIED; JESD-30 Code: X-PBGA-B785; |
| Datasheet | BCM5633 Datasheet |
| In Stock | 414 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Surface Mount: | YES |
| No. of Terminals: | 785 |
| Qualification: | Not Qualified |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | X-PBGA-B785 |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | BALL |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 1 |









