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| Manufacturer | Diodes Incorporated |
|---|---|
| Manufacturer's Part Number | CS5519CJI3FNTR-G1 |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | CS5519CJI3FNTR-G1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | YES |
| Terminal Finish: | MATTE TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 56 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 7 mm |
| JESD-30 Code: | S-XQCC-N56 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 80 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | HVQCCN |
| Width: | 7 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |
