Infineon Technologies - BGA612E6327HTSA1

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BGA612E6327HTSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGA612E6327HTSA1
Description WIDE BAND LOW POWER; Terminal Finish: Matte Tin (Sn); Construction: COMPONENT; Maximum Operating Frequency: 2800 MHz; Minimum Operating Temperature: -65 Cel; Characteristic Impedance: 50 ohm;
Datasheet BGA612E6327HTSA1 Datasheet
In Stock954
NAME DESCRIPTION
Other Names: BGA612E6327HTSA1CT
BGA612E6327XT
BGA612E6327INDKR-ND
BGA612E6327XTINCT-ND
BGA612E6327XTINTR-ND
SP000013391
BGA612E6327HTSA1DKR
BGA612E6327XTINTR
BGA612E6327INCT-ND
BGA612E6327INTR-ND
BGA612E6327
BGA612E6327INTR
BGA612E6327INDKR-NDR
BGA612E6327HTSA1TR
BGA612E6327INTR-NDR
BGA612E6327INCT-NDR
BGA612E6327INCT
BGA612E6327XTINCT
BGA612E6327INDKR
Construction: COMPONENT
Maximum Input Power (CW): 10 dBm
Minimum Operating Frequency: 0 MHz
Characteristic Impedance: 50 ohm
Maximum Operating Temperature: 150 Cel
Maximum Operating Frequency: 2800 MHz
RF or Microwave Device Type: WIDE BAND LOW POWER
Terminal Finish: Matte Tin (Sn)
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Gain: 16.3 dB
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