Infineon Technologies - BSS139E6327

BSS139E6327 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BSS139E6327
Description N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Terminal Form: GULL WING;
Datasheet BSS139E6327 Datasheet
In Stock159
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Configuration: SINGLE WITH BUILT-IN DIODE
Transistor Element Material: SILICON
Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR
Maximum Drain Current (ID): .1 A
Sub-Category: FET General Purpose Power
Surface Mount: YES
No. of Terminals: 3
Maximum Power Dissipation (Abs): .36 W
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G3
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: DEPLETION MODE
Maximum Operating Temperature: 150 Cel
Maximum Drain-Source On Resistance: 30 ohm
Moisture Sensitivity Level (MSL): 1
Maximum Feedback Capacitance (Crss): 3.3 pF
Polarity or Channel Type: N-CHANNEL
Minimum DS Breakdown Voltage: 250 V
Qualification: Not Qualified
Maximum Drain Current (Abs) (ID): .1 A
Peak Reflow Temperature (C): 260
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Pricing (USD)

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