Infineon Technologies - HYB25D256160CFL-6

HYB25D256160CFL-6 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB25D256160CFL-6
Description DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: FBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
Datasheet HYB25D256160CFL-6 Datasheet
In Stock143
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX16
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 2.3 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 60
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B60
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: FBGA
Width: 8 mm
No. of Ports: 1
Memory Density: 268435456 bit
Self Refresh: YES
Memory IC Type: DDR1 DRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Length: 12 mm
Maximum Access Time: .7 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: AUTO/SELF REFRESH
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.7 V
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Pricing (USD)

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