Infineon Technologies - HYB25R64160C-845

HYB25R64160C-845 by Infineon Technologies

Image shown is a representation only.

Manufacturer Infineon Technologies
Manufacturer's Part Number HYB25R64160C-845
Description RAMBUS DRAM; No. of Terminals: 54; Package Code: BGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Package Body Material: PLASTIC/EPOXY;
Datasheet HYB25R64160C-845 Datasheet
In Stock180
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX16
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 54
Maximum Clock Frequency (fCLK): 800 MHz
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B54
Package Shape: RECTANGULAR
Terminal Form: BALL
Package Code: BGA
Input/Output Type: COMMON
Memory Density: 67108864 bit
Memory IC Type: RAMBUS DRAM
JESD-609 Code: e0
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: BGA54,8X9,40/32
No. of Words Code: 4M
Terminal Pitch: .8 mm
Power Supplies (V): 1.8/2.5,2.5
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
180 - -

Popular Products

Category Top Products