Infineon Technologies - HYB39M83200Q125

HYB39M83200Q125 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYB39M83200Q125
Description SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
Datasheet HYB39M83200Q125 Datasheet
In Stock990
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .001 Amp
Organization: 256KX32
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
Maximum Supply Current: 195 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 128
Maximum Clock Frequency (fCLK): 125 MHz
No. of Words: 262144 words
Terminal Position: QUAD
Package Style (Meter): FLATPACK
Technology: CMOS
JESD-30 Code: R-PQFP-G128
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 70 Cel
Package Code: QFP
Input/Output Type: COMMON
Memory Density: 8388608 bit
Memory IC Type: SYNCHRONOUS DRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 32
Qualification: Not Qualified
Package Equivalence Code: QFP128,.67X.93,20
No. of Words Code: 256K
Nominal Supply Voltage / Vsup (V): 3.3
Terminal Pitch: .5 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 3.3
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Pricing (USD)

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990 - -

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