Infineon Technologies - HYE25L128800AC-7.5

HYE25L128800AC-7.5 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number HYE25L128800AC-7.5
Description SYNCHRONOUS DRAM; Temperature Grade: OTHER; No. of Terminals: 54; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
Datasheet HYE25L128800AC-7.5 Datasheet
In Stock63
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 2.3 V
Surface Mount: YES
No. of Terminals: 54
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B54
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Width: 8 mm
No. of Ports: 1
Memory Density: 134217728 bit
Self Refresh: YES
Memory IC Type: SYNCHRONOUS DRAM
Minimum Operating Temperature: -25 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 9 mm
Maximum Access Time: 5.4 ns
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: AUTO/SELF REFRESH
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 2.7 V
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