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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | HYE25L128800AC-7.5 |
Description | SYNCHRONOUS DRAM; Temperature Grade: OTHER; No. of Terminals: 54; Package Code: FBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; |
Datasheet | HYE25L128800AC-7.5 Datasheet |
In Stock | 63 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 16MX8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Access Mode: | FOUR BANK PAGE BURST |
Minimum Supply Voltage (Vsup): | 2.3 V |
Surface Mount: | YES |
No. of Terminals: | 54 |
No. of Words: | 16777216 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B54 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | FBGA |
Width: | 8 mm |
No. of Ports: | 1 |
Memory Density: | 134217728 bit |
Self Refresh: | YES |
Memory IC Type: | SYNCHRONOUS DRAM |
Minimum Operating Temperature: | -25 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Length: | 9 mm |
Maximum Access Time: | 5.4 ns |
No. of Words Code: | 16M |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Additional Features: | AUTO/SELF REFRESH |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Maximum Supply Voltage (Vsup): | 2.7 V |