Infineon Technologies - S27KL0642GABHM023

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S27KL0642GABHM023 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number S27KL0642GABHM023
Description HYPERRAM; No. of Terminals: 24; Package Code: BGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Package Body Material: PLASTIC/EPOXY;
Datasheet S27KL0642GABHM023 Datasheet
In Stock823
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 64MX1
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 24
Maximum Clock Frequency (fCLK): 200 MHz
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Screening Level: AEC-Q100
Technology: CMOS
JESD-30 Code: R-PBGA-B24
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 125 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
No. of Ports: 1
Memory Density: 67108864 bit
Memory IC Type: HYPERRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Maximum Access Time: 35 ns
No. of Words Code: 64M
Maximum Supply Voltage (Vsup): 3.6 V
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