Kioxia Holdings - THGBMJG8C2LBAIL

THGBMJG8C2LBAIL by Kioxia Holdings

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Manufacturer Kioxia Holdings
Manufacturer's Part Number THGBMJG8C2LBAIL
Description FLASH CARD; Temperature Grade: OTHER; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32GX8
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 153
No. of Words: 34359738368 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 11 mm
Memory Density: 274877906944 bit
Memory IC Type: FLASH CARD
Minimum Operating Temperature: -25 Cel
Memory Width: 8
No. of Functions: 1
Package Equivalence Code: BGA153,14X14,20
Length: 13 mm
No. of Words Code: 32G
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 3.6 V
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