Microchip Technology - MPF200TS-FCS325M

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MPF200TS-FCS325M by Microchip Technology

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Manufacturer Microchip Technology
Manufacturer's Part Number MPF200TS-FCS325M
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: LFBGA; Package Shape: RECTANGULAR;
Datasheet MPF200TS-FCS325M Datasheet
In Stock459
NAME DESCRIPTION
Minimum Supply Voltage: .97 V
Package Body Material: Plastic/Epoxy
Maximum Seated Height: 1.45 mm
No. of Inputs: 170
Surface Mount: Yes
No. of Outputs: 170
Position Of Terminal: Bottom
No. of Terminals: 325
Package Style (Meter): Grid Array, Low Profile, Fine Pitch
JESD-30 Code: R-PBGA-B325
Package Shape: Rectangular
Maximum Operating Temperature: 125 °C (257 °F)
Package Code: LFBGA
Width: 11 mm
Grading Of Temperature: Military
Programmable IC Type: FPGA
Maximum Supply Voltage: 1.03 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 192000
Minimum Operating Temperature: -55 °C (-67 °F)
Package Equivalence Code: BGA325,21X21,20
Length: 14.5 mm
Form Of Terminal: Ball
Additional Features: It also Operates at 1.05 V nominal supply
Pitch Of Terminal: .5 mm
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