
Image shown is a representation only.
Manufacturer | Microchip Technology |
---|---|
Manufacturer's Part Number | MSCSM70VM19C3AG |
Description | N-CHANNEL; Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND SCR; Surface Mount: NO; Maximum Power Dissipation (Abs): 365 W; Terminal Form: UNSPECIFIED; Transistor Element Material: SILICON CARBIDE; |
Datasheet | MSCSM70VM19C3AG Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | UNSPECIFIED |
Configuration: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND SCR |
Transistor Element Material: | SILICON CARBIDE |
Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
Transistor Application: | SWITCHING |
Maximum Drain Current (ID): | 124 A |
Maximum Pulsed Drain Current (IDM): | 250 A |
Surface Mount: | NO |
No. of Terminals: | 25 |
Maximum Power Dissipation (Abs): | 365 W |
Terminal Position: | UPPER |
Package Style (Meter): | FLANGE MOUNT |
JESD-30 Code: | R-XUFM-X25 |
No. of Elements: | 2 |
Package Shape: | RECTANGULAR |
Terminal Form: | UNSPECIFIED |
Operating Mode: | ENHANCEMENT MODE |
Maximum Operating Temperature: | 150 Cel |
Case Connection: | ISOLATED |
Maximum Drain-Source On Resistance: | .019 ohm |
Maximum Feedback Capacitance (Crss): | 29 pF |
Polarity or Channel Type: | N-CHANNEL |
Minimum Operating Temperature: | -40 Cel |
Minimum DS Breakdown Voltage: | 700 V |
Maximum Drain Current (Abs) (ID): | 124 A |