Micron Technology - EBR51EC8ABKD-AD

  1. Home
  2. Micron Technology - EBR51EC8ABKD-AD
EBR51EC8ABKD-AD by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number EBR51EC8ABKD-AD
Description RAMBUS DRAM MODULE; No. of Terminals: 232; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Pitch: 1 mm; Power Supplies (V): 1.8/2.5,2.5;
Datasheet EBR51EC8ABKD-AD Datasheet
In Stock1,152
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 256MX18
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: NO
No. of Terminals: 232
Maximum Clock Frequency (fCLK): 1066 MHz
No. of Words: 268435456 words
Terminal Position: DUAL
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-PDMA-N232
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Package Code: DIMM
Input/Output Type: COMMON
Memory Density: 4831838208 bit
Memory IC Type: RAMBUS DRAM MODULE
Memory Width: 18
Qualification: Not Qualified
Package Equivalence Code: DIMM232,40
Maximum Access Time: 35 ns
No. of Words Code: 256M
Terminal Pitch: 1 mm
Power Supplies (V): 1.8/2.5,2.5
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,152 - -

Popular Products

Category Top Products

EDW4032BABG-70-F-D by Micron Technology

EDW4032BABG-70-F-D

Micron Technology

Micron Technology's EDW4032BABG-70-F-D is a 128MX32 DRAM with 1.35V supply, synchronous operation, and self-refresh capability. It features a grid array package style suitable for applications requiring high memory density and multi-bank page burst access mode in thin profile designs.
AS4C256M16D4-83BIN by Alliance Memory

AS4C256M16D4-83BIN

Alliance Memory

Alliance Memory's AS4C256M16D4-83BIN is a 256MX16 DDR4 DRAM with 1200 MHz clock frequency, 95°C operating temp, and 1.2V supply. Ideal for industrial applications requiring high memory density and fast data access in thin profile devices.
IS43LQ16128A-062BLI by Integrated Silicon Solution

IS43LQ16128A-062BLI

Integrated Silicon Solution

IS43LQ16128A-062BLI by Integrated Silicon Solution is a 128MX16 LPDDR4 DRAM with 1600 MHz clock frequency. It operates in synchronous mode, has a memory density of 2147483648 bit, and supports multi-bank page burst access. Ideal for industrial applications requiring high-speed data processing and low power consumption.
W9825G6KH-6I by Winbond Electronics

W9825G6KH-6I

Winbond Electronics

W9825G6KH-6I by Winbond Electronics is a 16MX16 Synchronous DRAM with 268Mbit memory density. Operating at 3.3V, it features self-refresh and offers a max access time of 5ns. Ideal for industrial applications requiring fast and reliable memory performance in a compact form factor.
W3H32M64E-533SBI by Microsemi

W3H32M64E-533SBI

Microsemi

Microsemi's W3H32M64E-533SBI DDR2 DRAM features 32MX64 organization, 1.8V supply voltage, and operates synchronously. Ideal for industrial applications with a temperature range of -40 to 85°C, it offers self-refresh capability and a memory density of 2147483648 bits.
NT5CC256M16ER-EKA by Nanya Technology

NT5CC256M16ER-EKA

Nanya Technology

NT5CC256M16ER-EKA by Nanya Technology is a DDR DRAM with 256MX16 organization, operating at 1.35V. It features synchronous operation, multi-bank page burst access mode, and industrial temperature grade. Suitable for applications requiring high memory density and fast data processing in compact devices.
S70KS1282GABHV020 by Infineon Technologies

S70KS1282GABHV020

Infineon Technologies

Infineon's S70KS1282GABHV020 is a 16MX8 DRAM with 200 MHz clock frequency, 1.8V supply voltage, and 105°C operating temp. Ideal for applications requiring high-speed synchronous memory in compact devices due to its low profile grid array package and common I/O type.
LH64256BK-70 by Sharp Corporation

LH64256BK-70

Sharp Corporation

LH64256BK-70 by Sharp Corp is a 256Kx4 DRAM with 512 refresh cycles, operating at 70ns access time. It features a CMOS technology, 3-STATE output characteristics, and operates in FAST PAGE mode. Ideal for commercial applications requiring high-speed memory with a memory density of 1048576 bits.
IS42S16320D-7BLI by Integrated Silicon Solution

IS42S16320D-7BLI

Integrated Silicon Solution

IS42S16320D-7BLI by Integrated Silicon Solution is a 32MX16 Synchronous DRAM with a max clock frequency of 143 MHz. It is commonly used in industrial applications and operates at a temperature range of -40 to 85 °C.
NT5CC64M16GP-DI by Nanya Technology

NT5CC64M16GP-DI

Nanya Technology

NT5CC64M16GP-DI by Nanya Technology is a DDR3L DRAM with 64MX16 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in compact devices like smartphones and tablets.
K4T51163QG-HCE6 by Samsung

K4T51163QG-HCE6

Samsung

Samsung's K4T51163QG-HCE6 DDR2 DRAM features 32MX16 organization, 333 MHz clock frequency, and 1.8V supply voltage. Ideal for high-performance applications requiring fast data processing and storage with a memory density of 536870912 bits.
MT41K128M16JT-107:KTR by Micron Technology

MT41K128M16JT-107:KTR

Micron Technology

Micron Technology's MT41K128M16JT-107:KTR is a DDR3L DRAM with 128MX16 organization, operating at 934.5 MHz clock frequency. It features a thin profile grid array package and operates in synchronous mode. Ideal for applications requiring high-speed memory access and low power consumption.
KM416V256ALT-7 by Samsung

KM416V256ALT-7

Samsung

Samsung's KM416V256ALT-7 is a 256Kx16 DRAM with 3.3V supply, operating in asynchronous mode. It features fast page access, 70ns max access time, and 512 refresh cycles. Ideal for applications requiring high-speed memory with low power consumption.
MT40A512M8SA-062EAAT:F by Micron Technology

MT40A512M8SA-062EAAT:F

Micron Technology

Micron Technology's MT40A512M8SA-062EAAT:F is a DDR4 DRAM with 512MX8 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast data access with a temperature range of -40 to 105°C.
M378B5673EH1-CH9 by Samsung

M378B5673EH1-CH9

Samsung

Samsung M378B5673EH1-CH9 DDR DRAM features 256MX64 organization, operates at 667 MHz with 3-STATE output. Suitable for high-performance computing applications due to its synchronous operation and self-refresh capability.
MT48LC4M16A2P-75:GTR by Micron Technology

MT48LC4M16A2P-75:GTR

Micron Technology

Micron Technology's MT48LC4M16A2P-75:GTR is a 3.3V Synchronous DRAM with 4MX16 organization, operating at 70°C max temp. It features self-refresh mode, small outline package, and dual terminal position. Ideal for commercial applications requiring fast access time and high memory density.
MT8KTF51264HZ-1G9P1 by Micron Technology

MT8KTF51264HZ-1G9P1

Micron Technology

MT8KTF51264HZ-1G9P1 by Micron Technology is a DDR3L DRAM MODULE with 512MX64 organization. It operates in synchronous mode, has a self-refresh feature, and a nominal voltage of 1.35V. It is commonly used in commercial applications requiring high memory density and single bank page burst access mode.
K4A8G165WC-BCTD by Samsung

K4A8G165WC-BCTD

Samsung

Samsung's K4A8G165WC-BCTD is a 512MX16 DDR4 DRAM with 1333 MHz clock frequency. Operating at 1.2V, it offers 8589934592 bit memory density and supports multi-bank page burst access mode. Ideal for applications requiring high-speed data processing in compact devices due to its thin profile and fine pitch package style.
MT47H128M8SH-25EIT:M by Micron Technology

MT47H128M8SH-25EIT:M

Micron Technology

Micron Technology's MT47H128M8SH-25EIT:M is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
S70KS1282GABHI020 by Infineon Technologies

S70KS1282GABHI020

Infineon Technologies

Infineon's S70KS1282GABHI020 is a 16MX8 DRAM with 200 MHz clock frequency, 1.8V supply voltage, and 85°C operating temp. Ideal for applications requiring high-speed synchronous memory in compact devices due to its very thin profile grid array package style.