Micron Technology - EDW1032BBBG-50-F

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EDW1032BBBG-50-F by Micron Technology

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Manufacturer Micron Technology
Manufacturer's Part Number EDW1032BBBG-50-F
Description DDR5 DRAM; Temperature Grade: OTHER; No. of Terminals: 170; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet EDW1032BBBG-50-F Datasheet
In Stock1,628
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32MX32
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: YES
No. of Terminals: 170
No. of Words: 33554432 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B170
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 95 Cel
Package Code: FBGA
Input/Output Type: COMMON
Memory Density: 1073741824 bit
Sequential Burst Length: 8
Memory IC Type: DDR5 DRAM
Minimum Operating Temperature: 0 Cel
Memory Width: 32
Qualification: Not Qualified
Package Equivalence Code: BGA170,14X17,32
Refresh Cycles: 8192
Alternate Memory Width: 16
Interleaved Burst Length: 8
No. of Words Code: 32M
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 1.35/1.5
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