Micron Technology - MT8JSF25664HY-1G5B1

  1. Home
  2. Micron Technology - MT8JSF25664HY-1G5B1
MT8JSF25664HY-1G5B1 by Micron Technology

Image shown is a representation only.

Manufacturer Micron Technology
Manufacturer's Part Number MT8JSF25664HY-1G5B1
Description DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
Datasheet MT8JSF25664HY-1G5B1 Datasheet
In Stock954
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .08 Amp
Organization: 256MX64
Output Characteristics: 3-STATE
Sub-Category: DRAMs
Surface Mount: NO
Maximum Supply Current: 3680 mA
No. of Terminals: 204
Maximum Clock Frequency (fCLK): 667 MHz
No. of Words: 268435456 words
Terminal Position: DUAL
Package Style (Meter): MICROELECTRONIC ASSEMBLY
Technology: CMOS
JESD-30 Code: R-PDMA-N204
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Operating Temperature: 70 Cel
Package Code: DIMM
Input/Output Type: COMMON
Memory Density: 17179869184 bit
Memory IC Type: DDR DRAM MODULE
Minimum Operating Temperature: 0 Cel
Memory Width: 64
Qualification: Not Qualified
Package Equivalence Code: DIMM204,24
Refresh Cycles: 8192
No. of Words Code: 256M
Terminal Pitch: .6 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 1.5,3.3
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
954 - -

Popular Products

Category Top Products

MT53E256M32D2DS-046AIT:B by Micron Technology

MT53E256M32D2DS-046AIT:B

Micron Technology

Micron Technology's MT53E256M32D2DS-046AIT:B is a 256MX32 LPDDR4 DRAM with a max clock frequency of 2133 MHz. It operates in synchronous mode, has a self-refresh feature, and is commonly used in automotive applications due to its AEC-Q100 screening level.
IS43LQ16128A-062BLI by Integrated Silicon Solution

IS43LQ16128A-062BLI

Integrated Silicon Solution

IS43LQ16128A-062BLI by Integrated Silicon Solution is a 128MX16 LPDDR4 DRAM with 1600 MHz clock frequency. It operates in synchronous mode, has a memory density of 2147483648 bit, and supports multi-bank page burst access. Ideal for industrial applications requiring high-speed data processing and low power consumption.
MT41J64M16JT-15EAAT:G by Micron Technology

MT41J64M16JT-15EAAT:G

Micron Technology

Micron Technology's MT41J64M16JT-15EAAT:G is a DDR3 DRAM with 64MX16 organization, operating at 667 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in automotive electronics and industrial control systems.
MT40A1G16RC-062EIT:BTR by Micron Technology

MT40A1G16RC-062EIT:BTR

Micron Technology

DDR4 DRAM; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
MT46V16M16P-5B:MTR by Micron Technology

MT46V16M16P-5B:MTR

Micron Technology

Micron Technology's MT46V16M16P-5B:MTR is a DDR1 DRAM with 16MX16 organization, operating at 2.6V. It features synchronous operation, self-refresh capability, and a memory density of 268MB. Ideal for applications requiring fast access times and high memory capacity in commercial temperature environments.
IS42S16400J-7TL-TR by Integrated Silicon Solution

IS42S16400J-7TL-TR

Integrated Silicon Solution

IS42S16400J-7TL-TR by Integrated Silicon Solution is a 4MX16 Synchronous DRAM with 3.3V supply, 143 MHz clock frequency, and 70°C max temp. Ideal for applications requiring high-speed memory access in commercial-grade devices.
KM48S8030AT-G10 by Samsung

KM48S8030AT-G10

Samsung

Samsung's KM48S8030AT-G10 is an 8MX8 Synchronous DRAM with 67108864-bit memory density. It operates at a max clock frequency of 100 MHz and has a small outline, thin profile package style. Ideal for applications requiring high-speed data processing in commercial temperature environments.
MT48LC4M16A2P-75:GTR by Micron Technology

MT48LC4M16A2P-75:GTR

Micron Technology

Micron Technology's MT48LC4M16A2P-75:GTR is a 3.3V Synchronous DRAM with 4MX16 organization, operating at 70°C max temp. It features self-refresh mode, small outline package, and dual terminal position. Ideal for commercial applications requiring fast access time and high memory density.
AS4C16M16SA-7TCN by Alliance Memory

AS4C16M16SA-7TCN

Alliance Memory

AS4C16M16SA-7TCN by Alliance Memory is a 16MX16 Synchronous DRAM with 3.3V supply, operating at 143MHz. Ideal for commercial applications, it offers self-refresh capability and supports common I/O type with a package size of 22.22mm x 10.16mm in a small outline, thin profile style.
K4S281632O-LI75 by Samsung

K4S281632O-LI75

Samsung

Samsung's K4S281632O-LI75 is an 8MX16 DRAM with a memory density of 134217728 bit. It operates at a max clock frequency of 133 MHz and has a max access time of 5.4 ns. Ideal for industrial applications requiring high-speed data processing in compact devices.
S27KL0642GABHB023 by Infineon Technologies

S27KL0642GABHB023

Infineon Technologies

Infineon's S27KL0642GABHB023 DRAM features 8MX8 organization, operates synchronously at up to 200 MHz, and has a memory density of 67108864 bits. Ideal for automotive applications due to AEC-Q100 screening level and common I/O type.
MT48LC8M16A2P-6AIT:L by Micron Technology

MT48LC8M16A2P-6AIT:L

Micron Technology

Micron Technology's MT48LC8M16A2P-6AIT:L is a 3.3V Synchronous DRAM with 8MX16 organization, operating at up to 167 MHz clock frequency. It features self-refresh capability, common I/O type, and supports four-bank page burst access mode. Ideal for industrial applications requiring high memory density and fast access times.
MT41J128M16JT-093:K by Alliance Memory

MT41J128M16JT-093:K

Alliance Memory

DDR3 DRAM; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
W631GU6NB11I by Winbond Electronics

W631GU6NB11I

Winbond Electronics

Winbond Electronics' W631GU6NB11I is a DDR3L DRAM with 64MX16 organization, operating at up to 933 MHz. Featuring synchronous mode and self-refresh capability, it has a memory density of 1073741824 bit. Ideal for industrial applications requiring high-speed data processing in compact devices.
MT40A256M16GE-083EAUT:B by Micron Technology

MT40A256M16GE-083EAUT:B

Micron Technology

Micron Technology's MT40A256M16GE-083EAUT:B is a DDR4 DRAM with 256MX16 organization, operating at 1.2V. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for automotive applications due to AEC-Q100 screening level and thin profile grid array package style.
W3H32M64E-533SBI by White Electronic Designs

W3H32M64E-533SBI

White Electronic Designs

DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 208; Package Code: BGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
M471B5273CH0-CH9 by Samsung

M471B5273CH0-CH9

Samsung

Samsung M471B5273CH0-CH9 DDR DRAM Module features 256MX8 organization, operates at 667 MHz with 1.5V supply voltage. Ideal for high-performance computing applications due to its synchronous operation and self-refresh capability.
MT40A1G16KH-062EAIT:E by Micron Technology

MT40A1G16KH-062EAIT:E

Micron Technology

Micron Technology's MT40A1G16KH-062EAIT:E is a DDR4 DRAM with 1GX16 organization, operating at up to 1600 MHz. It features common I/O type, synchronous mode, and self-refresh capability. Ideal for applications requiring high-speed memory in automotive and industrial environments.
KM44C256BP-7 by Samsung

KM44C256BP-7

Samsung

Samsung's KM44C256BP-7 is a 256Kx4 DRAM with 262144 words and memory density of 1048576 bits. Operating at 5V, it has a max access time of 70ns and refresh cycles of 512. Ideal for applications requiring fast page access in commercial temperature grades.
LH64256BK-70 by Sharp Corporation

LH64256BK-70

Sharp Corporation

LH64256BK-70 by Sharp Corp is a 256Kx4 DRAM with 512 refresh cycles, operating at 70ns access time. It features a CMOS technology, 3-STATE output characteristics, and operates in FAST PAGE mode. Ideal for commercial applications requiring high-speed memory with a memory density of 1048576 bits.