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| Manufacturer | Micron Technology |
|---|---|
| Manufacturer's Part Number | NANDBAW4N1BZBC5F |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 137; Package Code: FBGA; Package Shape: RECTANGULAR; Power Supplies (V): 2.5/3.6; |
| Datasheet | NANDBAW4N1BZBC5F Datasheet |
| In Stock | 1,090 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Mixed Memory Type: | FLASH+SDRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -30 Cel |
| No. of Terminals: | 137 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA137,10X15,32 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| JESD-30 Code: | R-PBGA-B137 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 2.5/3.6 |
