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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | BAP55LX |
Description | PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR; |
Datasheet | BAP55LX Datasheet |
In Stock | 132 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Config: | SINGLE |
Diode Type: | PIN DIODE |
Frequency Band: | S BAND |
Surface Mount: | YES |
Terminal Finish: | Tin (Sn) |
No. of Terminals: | 2 |
Terminal Position: | BOTTOM |
Maximum Diode Capacitance: | .28 pF |
Package Style (Meter): | CHIP CARRIER |
Technology: | POSITIVE-INTRINSIC-NEGATIVE |
JESD-30 Code: | R-PBCC-N2 |
No. of Elements: | 1 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Maximum Diode Forward Resistance: | .8 ohm |
Moisture Sensitivity Level (MSL): | 1 |
Nominal Minority Carrier Lifetime: | .27 us |
JESD-609 Code: | e3 |
Diode Element Material: | SILICON |
Qualification: | Not Qualified |
Maximum Power Dissipation: | .135 W |
Peak Reflow Temperature (C): | 260 |
Application: | ATTENUATOR; SWITCHING |