NXP Semiconductors - BAP55LX

BAP55LX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BAP55LX
Description PIN DIODE; Terminal Position: BOTTOM; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Datasheet BAP55LX Datasheet
In Stock132
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): 30
Config: SINGLE
Diode Type: PIN DIODE
Frequency Band: S BAND
Surface Mount: YES
Terminal Finish: Tin (Sn)
No. of Terminals: 2
Terminal Position: BOTTOM
Maximum Diode Capacitance: .28 pF
Package Style (Meter): CHIP CARRIER
Technology: POSITIVE-INTRINSIC-NEGATIVE
JESD-30 Code: R-PBCC-N2
No. of Elements: 1
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Maximum Diode Forward Resistance: .8 ohm
Moisture Sensitivity Level (MSL): 1
Nominal Minority Carrier Lifetime: .27 us
JESD-609 Code: e3
Diode Element Material: SILICON
Qualification: Not Qualified
Maximum Power Dissipation: .135 W
Peak Reflow Temperature (C): 260
Application: ATTENUATOR; SWITCHING
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Pricing (USD)

Qty. Unit Price Ext. Price
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