NXP Semiconductors - BGA2012,115

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BGA2012,115 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGA2012,115
Description NARROW BAND LOW POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 10 mA;
Datasheet BGA2012,115 Datasheet
In Stock76
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Construction: COMPONENT
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 10 mA
Terminal Finish: Tin (Sn)
JESD-609 Code: e3
Mounting Feature: SURFACE MOUNT
No. of Functions: 1
No. of Terminals: 6
Package Equivalence Code: TSSOP6,.08
Technology: BIPOLAR
Characteristic Impedance: 50 ohm
Maximum Operating Temperature: 150 Cel
RF or Microwave Device Type: NARROW BAND LOW POWER
Gain: 14 dB
Power Supplies (V): 3
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