NXP Semiconductors - BGA2012

BGA2012 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number BGA2012
Description NARROW BAND LOW POWER; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; JESD-609 Code: e3;
Datasheet BGA2012 Datasheet
In Stock1,307
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Construction: COMPONENT
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 10 mA
Terminal Finish: Tin (Sn)
JESD-609 Code: e3
Mounting Feature: SURFACE MOUNT
No. of Functions: 1
No. of Terminals: 6
Package Equivalence Code: TSSOP6,.08
Technology: BIPOLAR
Characteristic Impedance: 50 ohm
Maximum Operating Temperature: 150 Cel
RF or Microwave Device Type: NARROW BAND LOW POWER
Gain: 14 dB
Power Supplies (V): 3
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
1,307 $0.300 $392.100

Popular Products

Category Top Products