NXP Semiconductors - BGY887,112

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BGY887,112 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number BGY887,112
Description WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Maximum Supply Current: 235 mA; Package Equivalence Code: SOT-115J;
Datasheet BGY887,112 Datasheet
In Stock204
NAME DESCRIPTION
Other Names: BGY887-ND
BGY887
568-5632
BGY887,112-ND
954-BGY887112
934039280112
Package Body Material: PLASTIC/EPOXY
Construction: MODULE
Minimum Operating Frequency: 40 MHz
Sub-Category: RF/Microwave Amplifiers
Maximum Supply Current: 235 mA
Minimum Operating Temperature: -20 Cel
Package Equivalence Code: SOT-115J
Technology: HYBRID
Characteristic Impedance: 75 ohm
Additional Features: LOW NOISE, HIGH RELIABILITY
Maximum Operating Temperature: 100 Cel
Maximum Operating Frequency: 860 MHz
RF or Microwave Device Type: WIDE BAND HIGH POWER
Gain: 21.5 dB
Power Supplies (V): 24
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