NXP Semiconductors - MC9328MXLCVP15

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MC9328MXLCVP15 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9328MXLCVP15
Description SoC; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;
Datasheet MC9328MXLCVP15 Datasheet
In Stock632
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 225
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B225
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Peripheral IC Type: SoC
Maximum Supply Voltage: 1.9 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Package Equivalence Code: BGA225,15X15,32
Length: 13 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
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Pricing (USD)

Qty. Unit Price Ext. Price
632 $10.693 $6,757.976

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