NXP Semiconductors - MC9328MXLVM15R2

MC9328MXLVM15R2 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MC9328MXLVM15R2
Description SoC; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;
Datasheet MC9328MXLVM15R2 Datasheet
In Stock3,822
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: 1.9 V
Maximum Seated Height: 1.6 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 256
Package Equivalence Code: BGA256,16X16,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Length: 14 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Peak Reflow Temperature (C): 260
Package Code: LFBGA
Width: 14 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
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