NXP Semiconductors - MF3ICD8101DUD/01

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MF3ICD8101DUD/01 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MF3ICD8101DUD/01
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;
Datasheet MF3ICD8101DUD/01 Datasheet
In Stock443
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Maximum Supply Current: 30 mA
Minimum Operating Temperature: -25 Cel
Qualification: Not Qualified
Package Equivalence Code: WAFER
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: X-XUUC-N
Package Shape: UNSPECIFIED
Terminal Form: NO LEAD
Maximum Operating Temperature: 70 Cel
Package Code: DIE
Temperature Grade: OTHER
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