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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MF3ICD8101DUD/01 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified; |
| Datasheet | MF3ICD8101DUD/01 Datasheet |
| In Stock | 443 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Sub-Category: | Other Microprocessor ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 30 mA |
| Minimum Operating Temperature: | -25 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | WAFER |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| JESD-30 Code: | X-XUUC-N |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIE |
| Temperature Grade: | OTHER |









