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Manufacturer | NXP Semiconductors |
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Manufacturer's Part Number | MF3MODH2101DA8/05 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: PLASTIC/EPOXY; |
Datasheet | MF3MODH2101DA8/05 Datasheet |
In Stock | 1,339 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Terminal Position: | UNSPECIFIED |
Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
Technology: | CMOS |
JESD-30 Code: | X-PXMA-N |
Package Shape: | UNSPECIFIED |
Terminal Form: | NO LEAD |
Maximum Operating Temperature: | 70 Cel |
Surface Mount: | YES |
Minimum Operating Temperature: | -25 Cel |
Temperature Grade: | OTHER |