NXP Semiconductors - MPC8250ACVVIHBX

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MPC8250ACVVIHBX by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8250ACVVIHBX
Description MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: HLBGA; Package Shape: SQUARE;
In Stock1,254
NAME DESCRIPTION
Minimum Supply Voltage: 1.7 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Integrated Cache: YES
Maximum Seated Height: 1.65 mm
Surface Mount: YES
No. of Terminals: 480
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B480
Maximum Clock Frequency: 66.66 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 70 Cel
Package Code: HLBGA
Width: 37.5 mm
Speed: 200 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.9 V
Low Power Mode: NO
Boundary Scan: YES
External Data Bus Width: 64
Bit Size: 32
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Length: 37.5 mm
Additional Features: ALSO REQUIRES 3.3V SUPPLY
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
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