NXP Semiconductors - MPC8544EBVTALG

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MPC8544EBVTALG by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC8544EBVTALG
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 783; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;
Datasheet MPC8544EBVTALG Datasheet
In Stock3,737
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1 V
Integrated Cache: YES
Maximum Seated Height: 2.8 mm
Surface Mount: YES
No. of Terminals: 783
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B783
Maximum Clock Frequency: 133 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 105 Cel
Package Code: HBGA
Width: 29 mm
Speed: 667 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 1.05 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
Minimum Operating Temperature: 0 Cel
Length: 29 mm
Terminal Pitch: 1 mm
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